ESI
-
9250B:
Laser Semiconductor Processing System.
Cassette to cassette wafer handling for wafers up to 200mm.
Pattern recognition.
Submicron positioning accuracy.
Stable precise energy control.
System Manufactured in 1996.
Inventory#:
39501
APT
-
280AN:
Galium Arsenide Wafer Titler.
Exposes up to 16 easy to read alphanumeric characters across the wafer flat or at 3 other selectable locations in 90 degree increments from the flat. It handles 3 to 5 in. wafers.
Inventory#:
44014
ROFIN
-
LME STARMARK:
Laser Marking System.
Lasercad fully programmable software for mark layout designs.
Full on-screen representation of marking job layouts including text,
graphics, bar codes or 2D matrix codes.
3W diode pumped YAG laser.
Programmable Z axis. 18 in. x 18 in. breadboard tooling platform
with Parker Daedel X-Y precision stage with encoder feedback.
Stage 081-1486 Rev. B. Mfg. 2001.
Inventory#:
47994
ESI
-
4420:
Laser Micromachining System.
Solves problems associated with smaller vias, finer lines and new materials, allowing manufacturers to achieve new levels of micromachining accuracy and control.
Step and Repeat Parts Handling Travel: 152.4 mm x 152.4 mm.
Laser Beam Positioning Field Size: 76.2 mm x 76.2 mm.
Accuracy: +/-5 micrometers. Resolution: 2.5 micrometers.
Q-Switched Nd:Yag Laser, 266 nm with peak power 3.3 kW.
208V, 3 Ph, 60 Hz. Date of Mfg.: 4/2000
Inventory#:
55117
CADCAM TECHNOLOGY
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FB 750:
Laser Cutting System.
PC with CadCam software. Variable cutting speeds from 10 mm/s to 600 mm/s.
High precision stepless laser cutting.
50W laser with 33 in. bed.
A fine, clean, accurate depth of cut is achieved by software control of power output and cutting speed.
Can even etch onto paper.
Cuts plastics, paper, wood, leather, fabrics, reflective and retro-reflective materials.
Mfg. 8/04.
Inventory#:
48541
CONTROL MICRO SYSTEMS
-
CMS UL-10:
Semi-Automatic, Manual Load CO2 Laser Marking System.
Computer controlled laser and X-Y stage allow advanced
parts marking from a simple user friendly screen.
10W sealed CO2 laser with 2 in. super high resolution lens assembly.
Computer controlled 6 in. x 12 in. X-Y axes.
CDRH Class 1 compliant enclosure with safety interlocked door.
Mfg. 02/2001
Inventory#:
49972
GENERAL SCANNING
-
XY10A/R1-000-Y2:
CW Green Laser with Scan Head Module.
2 Axis galvanometer scan head provides the capability of deflecting optical beams in a XY manner.
220V, 60 Hz.
Inventory#:
52750
DATA RAY
-
BEAM MAP:
Laser Beam Profiling System.
Evaluate precision laser and fiber optic assemblies.
Real Time M2, profiling, divergence, focusing and alignment.
Head Model: BMH4XY500/IGA.
InGaAs detector head.
Inventory#:
44976
DAECO ELECTRONICS
-
LASER BURN-IN TESTER:
5 drawer system.
Each drawer contains a programmable DC power supply, carousel temp. readout, elapsed time display.
Inside the drawer is a carousel for testing
20 lasers. Water cooled.
Job #P010-3911-1.
Inventory#:
54071
BURLEIGH
-
HI Fase 800-1:
Etalon System.
760-840 nm. Only what is in the photo.
No power supply or cables.
Cannot test unit but will give the 30 day money back option.
Inventory#:
54580
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ESI
-
4420:
Laser Micromachining System.
Solves problems associated with smaller vias, finer lines and new materials, allowing manufacturers to achieve new levels of micromachining accuracy and control.
Step and Repeat Parts Handling Travel: 152.4 mm x 152.4 mm.
Laser Beam Positioning Field Size: 76.2 mm x 76.2 mm.
Accuracy: +/-5 micrometers. Resolution: 2.5 micrometers.
Q-Switched Nd:Yag Laser, 266 nm with peak power 3.3 kW.
208V, 3 Ph, 60 Hz. Date of Mfg.: 4/2000
Inventory#:
55117
