AEROTECH -
UNIDEX 12R:
Multi-Axis Stage Controller.
Linear interpolation and velocity profiling in a high performance, 1- to 2-axis controller.
Large 30 KB program memory, up to 99 programs storable.
Versatile programming features include branching, nested subroutines,
and high speed interrupt capabilities.
Inventory#:
25702 View
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MRC -
603-II:
Side Sputtering System w/Etch Capabilities.
Currently configured with 3 D.C. Magnetron Cathodes (inset cathodes).
Alcatel 2033 Roughing Pump. CTI-8 Cryopump. 1500W RF Generator.
Automatic or manual controls for vacuum system and sputtering process.
4 process gas capability.
Average cycle time: 13.0 minutes.
Typical target utilization: Ti-W Inset 35 percent, Al Inset 50 percent.
Cathode size: 4-3/4 in. x 14-7/8 in.
Sputter etch: 1.5 kW RF.
CRT screen monitoring, keyboard parameter control, full automation.
With manuals. 208V, 60 Hz, 3 Ph, 110A.
Inventory#:
21983 View
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FPM -
SC 4102:
Wet Bench Process Analyzer.
On-line chemical analysis allows for real-time correction of chemical composition, thus stabilizing and speeding up the process, The rewards for improved chemical control is remarkable, allowing for consistently faster processing which drastically increase throughput.
Inventory#:
34645 View
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EMC -
12A Eagle:
Flexible Batch Cleaning System.
Wash chamber accommo-dates up to 12 x 12 x 12 in. parts basket.
Heated spray under immersion wash cycle.
Heated open spray rinse cycle.
Open loop final rinse.
Internal filtration to 1 micron.
Forced hot air convection drying.
System Mfg. 1997.
Inventory#:
33427 View
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TEGAL -
900E:
Cassette to Cassette Photoresist Strip/Backside Etching.
Spatula wafer transport from cassette to cassette.
Users are guided through programming and
operation by menu-driven software and soft-keys
via a built in display and an external terminal.
System is currently configured for 4 in. wafers.
Inventory#:
33748 View
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PANASONIC -
AG-6720 VCR:
Time Lapse Recorder.
Horizontal resolution of 400 lines.
Double fine slow-motion recording and playback.
Complete range of time lapse modes: VHS and S-VHS in which audio signals can be recorded, the intermittent recording (for 24-, 48-, 72-, 120-, 180-, 240-, 480 hour or 1 shot modes).
Inventory#:
27274 View
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ANATECH -
Phase III:
Semiconductor Thermal Meas. Unit.
Controller Only.
Phase III Thermal Tester.
Sense current settings on back of system, 10, 50, 100, 1000 microamp.
BNC connectors on back, Samp.V, Dev.V, Temp, Samp.TRIG. Dev.I + -.
Front panel, Internal supply ADJ, Device pwrInt. - Ext, current source/sink,
current polarity +/-,Switching time ADJ, device supply, Aux thermocouple.
115 V, 60 Hz, 4A.
Inventory#:
32577 View
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KLA -
1007:
Automatic Wafer Prober.
100 wafer capacity reduces loading/unloading requirements.
The system accepts wafers from 3-6 in. in dia.
Probe Tip Polishing: Programmable probe
tip polisher uses a fused ceramic disk.
Utilities:100/115/200/220/240 VAC, 50/60 Hz., 2.2 KVA
XY Table: Standard travel 7.3 x 15.0 in.
Speed: 4.9 in./sec.
Resolution: .01 mil.
Accuracy including alignment: .5 mil.
Repeatability: +/-.1 mil.
XY index setting:.1 to 9999.9 mils.
Vertical Max. travel: 590 mils.
Adaptive range: 352-531 mils.
Programmable overdrive: 0-8 mils.
Rotational: Chuck rotation +/- degrees.
Angular resolution: .0005 degrees.
6 in. chuck.
Sold As Is.
Inventory#:
29137 View
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DAGE -
BT 25:
Automatic Wirebond Tester.
Offers the benefit of full microprocessor control, to ensure 100 percent testing of up to 15,000 discrete points per substrate. Easily programmed using alphanumeric keyboard and liquid-crystal display, the Series 25 meets the requirements of MIL-STD-883 with a speed of (less than 2 sec. per wire), precision (±5 micro-meters), and consistency +/- 10 micro-meters).
Inventory#:
27304 View
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SHINKAWA -
SWB-FA-US-30:
Automatic Wire Bonder.
Aluminum wedge wire bonder for low to high lead-count devices with different configuration.
Wedge stroke: Capable of clearing the protuberance 7.5mm high
at maximum from the device surface.
Overall bonding accuracy of +10mm realized by the upgrading
of both the pattern recognition and mechanical accuracy.
Bonding Method: Ultrasonic (pull-cut) wedge bonding.
Pattern recognition time: within 0.25 sec. (2-point alignment).
Recognition range: XY: + 0.23mm. q: +5 deg. Recognition accuracy: 3.7mm.
Bonding area: X: 20mm, Y: 20mm
Inventory#:
25630 View
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K&S -
5408-15 EM:
Die Attach System.
Enables multi-chip module production through an exclusive multi-pass system that features a selectable leadframe unstacker and magazine loader for input of leadframes with die already attached.
The die attach system is optimized for small, medium and large die picked from either wafer or waffle packs, including high value, yield sensitive die. Robust vision processing enhances system flexibility by performing wafer leadframe, adhesive, and post-bond inspection during the bonding process.
Wafer Size: Up to 8 in. in diameter (max.); requires separate clamp ring kits for 5 in., 6 in. or 8 in. wafers.
Die Size: 0.150 in. to .600 in. Bonding Accuracy: Die placement (X-Y): plus or minus 2 mils, 3 sigma; Die rotation: plus or minus 1 deg., 3 sigma
Dispense Capability: X-Y-Z axis positioning micrometer adjustable, Programmable post-dispense dwell. Dispense duration: 0 to 1 minute Utilities: Electrical: 208-240VAC (plus or minus 5 percent VAC), single phase, 50/60 Hz; Air: 80 psi (min), clean/dry at 4 SCFM.
Inventory#:
32619 View
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SHINKAWA -
SDP-FA-TAPE 1:
System automatically takes die from a waffle pack and seals them on a tape and reel.
Inventory#:
31051 View
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SHINKAWA -
SDP-FA-4.1:
Fully Automatic Die Pick & Place Machine.
Automatically detects and picks up only good dice from probed and
diced wafers and neatly place them on a die tray.
Maximum wafer 6 in. dia.
Wafer ring size 194mm dia.max.
Accuracy of die pickup +/- 200 mm in X and Y directions.
Inventory#:
31054 View
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MEYER BURGER -
TS-116:
Slicing Machine.
Controller: GE Fanuc Series O-M. MFG. 1989.
For automatic slicing of ceramic materials, ferrite, quartz, optical glass.
Slicing blade dia. 100-150 mm.
1 fixed spindle speed range from 2500-8000 RPM.
Longitudinal path:300 mm
Cross path: 140 mm.
Vertical path: 100 mm.
Resolution in all 3 axes: 0.001 mm.
Feed speeds programmable from 5-2000 mm/min.
Workable: 300 x 150 mm.
Distance spindle axis workable:50-150 mm.
Inventory#:
26880 View
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SOFTEX -
ISV-100W:
X-Ray Imaging System.
8 x 6 in. X-Y stage.
X-Ray TV camera.
Hitachi monitor.
100 KVP source.
Sony digital printer.
120V, 50/60 Hz.
Inventory#:
26876 View
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AG ASSOCIATES -
610:
Rapid Thermal Processor.
Benchtop system for rapid thermal processing of semiconductor wafers up to 6 in. dia. max.
(depends on wafer tray with system).
Programmable ramp up rates.
Peak temperature: 1350 deg C.
Recommended steady state temperature range: 400 to 1150 deg C.
Inventory#:
54116 View
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PERKIN ELMER -
Plasma II:
Inductively Coupled Plasma Emission Spectrometer.
Utilizes two separate one meter Ebert monochromators operating totally independent of the other, providing high speed of analysis of up to 50 elements/min. Long-term wavelength stability unequaled; wavelength calibration can be verified by use of a built-in low pressure Hg light source. Incorporates a Myers-Tracy Signal Compensation System to correct for signal variations due to short-term noise and signal fluctuations. System completely thermostatted and vibration isolated. Customized laboratory reports can be generated, in which all data or selected results can be summarized with results listed by element or by sample.
Inventory#:
28864 View
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WATERS -
CAPILLARY ION ANALYZER:
CIA is a proven, dependable, and predictable method for analyzing small ionic species. Separations are performed by applying an electrical field to the sample in a capillary filled with an electrolyte. Rapid, simple, and highly sensitive analytical technique.
Inventory#:
32636 View
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STRASBAUGH -
6SR4:
Double Sided Polisher.
System designed for polishing both sides of small parts.
Top and bottom slurry feeds.
20 in. dia. reciprocating top plate.
20 in. dia. rotating bottom plate.
208V, Single Phase, 60Hz, 25A.
Inventory#:
33246 View
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MCT -
LS 2600:
Lead Scanner.
The Model LS 2600 is a lead scanner for 600 mil devices. The 2600 scanner can test up to 5,000 devices per hour . A sort verification system on the 2600 compares the actual output reservoir selected with the original category signal selection command from the scanner module.
Inventory#:
30762 View
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MCT -
2608:
Elevated Temp. I.C. Handler.
Gravity feed with Air assist.
Input: 13 heated reservoirs (24 in. long) accepts any single track stick.
Output: 8 reservoirs (24: long) accepts any single track A or B frame stick.
Dip size: 600 mil. 8 programmable sort categories (sort signal can be +/-TRUE at 3.5V min. to 30V max. w/5 msec min. width). Handler supplies test ready signal to the tester at +/-TRUE.
Homogeneous gold platinum alloy contacts: 0.050 ohms. Interlead capacitance of 5 pf (kelvin) 3 pf (non Kelvin). Temp. control range is from ambient to 125 deg. C +/- 12 deg. C.
Requires: 200 CFH Air at 20 PSI; 105-125V, 50/60 Hz at 18A max., weight 125 lbs.
Inventory#:
23617 View
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TELEDYNE PEER -
P-25:
Welder.
With Technitron MCS 2109 Controller.
Platen Area: 4 in. x 4 in.
Standard Strokes of Ram: 3 in.
Electrode Holder: 1 in. dia.
Max. opening between platen: 6 in.
Max. Pres. at 80 psi 1000 lbs.
Requires: 460V, 60Hz
Glove Box: 42 in. x 26 in. x 16 in.
2 Air Locks: 15 in. x 12 in. x 9 in.
Inventory#:
15285 View
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FUJI -
GSP-4000:
Screen Printer.
14 in. x 18 in. print area.
Squeegee blade and flood blade: 9 in. wide.
Inventory#:
23534 View
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ASYMTEK -
A-618C:
Inline Automated Fluid Dispensing System.
Ideal for medium volume production.
Can be configured to dispense a wide variety of fluids, from gasketing materials to solder mask and solder paste.
Easy-to-use, flexible, DOS-based Fluidmove® software for CAD download or move-teach programming.
Vision system to optimize programming accuracy.
Needle sensor for automatic compensation of XYZ changes.
Drive System: X-Y Speed: 0-508 mm/s (0-20 in./s).
Repeatability: 0.025 mm (0.001 in.).
Positional Resolution: 0.025 mm (0.001 in.).
Computer: Pentium®-based PC.
Speed of Conveyor: Programmable up to 25.4 cm/s (10 in./s).
Conveyor Compatibility: SMEMA.
Board Carrier Flow Direction: Field programmable, right to left or left to right.
Inventory#:
34542 View
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UNIVERSAL OMNIPLACE -
4621A:
SMC Placement System.
Accuratecomponent placement.
Flexible feeder input.
Large placement area for multiple board sizes.
Capable of processing both PC boards and ceramic substrates.
Inventory#:
25646 View
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FUJI -
FGL:
High Speed Glue Dispenser.
This glue dispenser can apply glue with high accuracy and a low cycle time. User friendly operation and easy changeover are also incorporated into the machine design. With Computer
Inventory#:
23927 View
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UNIVERSAL INSTRUMENTS -
4713 ADM:
Dispense Module.
Designed to apply dots of adhesive on printed circuit boards (PCB) to prepare them for placement of surface mounted components.
Positioning and board handling system can accommodate the same size PCB as the PASS-THRU II system: a maximum of 18 in. x 16 in. (457.2 mm x 406.4mm).
The maximum PCB placement area of the model 4713D is 18 x 15.84 in. in the X and Y axes.
Inventory#:
29716 View
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CAM/ALOT -
1414:
Liquid Dispensing Machine.
The system can be configured for a variety of SMT applications and is an excellent tool for R&D and process calibration.
Dispensing area: 14 in. x 14 in.
Lead screw drives on all three axes.
Travel X & Y Axes: 14 in. (350mm).
Travel Z Axis: 2 in. (50mm).
Resolution: .001 in. (25m).
Repeatability: +/-.002 in. (+/-50m). Speed: 10 IPS (250mm/sec).
Dispensing rate: 13,000 dots/hr. Dot placement accuracy: +/-.003 in. (+/-75m) at 3 Sigma.
115V, 60Hz, 10A. Has camera option, NO PC or software. Sold As Is.
Inventory#:
23702 View
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DAGE -
4000:
Modular Multifunction Bond and Shear Tester.
DS100 die shear load cell and WP100 wire pull load cell.
Intuitive operating screens enable quick test setup and editing of test parameters.
On-board statistical results analysis package provides test results by grade, mean load, standard deviation and CPK complete with distribution curve.
110/240V, 1 Ph, 50/60 Hz, CE.
Inventory#:
54249 View
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BLUE M -
OV-490A-3:
Bench Top Mechanical Convection Oven.
Single setpoint control with digital readout.
Max. Temp.: 260 deg C.
Inside Dimensions: 19 in. L x 15 in. W x 18 in. H.
120V, 60 Hz, 15.5A.
Inventory#:
54364 View
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SVG -
Series 90:
UV Coat & Develop Tracks.
Configured for 200 mm wafers. 4 Elevators Model 90211S.
Two track system one side with 3 develop stations and one side with 2 coat stations.
Glass enclosure with HEPA filtered hood, ion system static control, Semifab RAM 3500 environmental control unit and a Donaldson high purity products counter-flow adsorber module.
Two tank chemical cabinet with 4 DI water tanks and pumps.
Stepper interface module.
Top and bottom edge bead removal.
Spatula transfer arms between bake and chill plates.
Backside wash on develop station.
Modules (1)-57185, (2)-9037, (4)-9044, (2)-9026, (1)-9038, (3)-9036, (3)-9032.
SOLD AS IS.
Inventory#:
34337 View
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SEMICONDUCTOR SYSTEMS -
33-PCSBC-85 Model 150:
Three Track 85 in. Prime Bake-Cool-Spin-Bake-Cool System.
Three coat chambers.
Three prime bake modules.
Three bake modules.
Six cool modules.
System set up for 6 in.(150 mm) wafers.
IBM PC controller.
SECS II communications.
Programmable bottomside EBR and cup rinse.
HMDS bake temperature range 25-250 deg. C with programmable HMDS dispense.
AS IS.
Inventory#:
27065 View
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SEMICONDUCTOR SYSTEMS -
150-33-BCDBC-85:
Three Track 85 in. Bake-Cool-Develop-Bake-Cool Refurbished System.
Three develop chambers.
Six standard Bake Modules.
Six Cool Modules.
Temperature control unit (TCU) for develop chambers.
IBM capability AT-80486 controller interface.
SEC II communications.
System set up for 6 in.(150 mm) size wafer capability.
Standard Bake Module - Temperature Range 25 - 250 deg. C.
AS IS
Inventory#:
27066 View
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STI -
ST-4062:
Developer.
Tymkon Multiple Input/Output Controller.
Dual solution and reclaim system.
110V, 15A.
Inventory#:
17405 View
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APT -
924:
Emulsion Processor.
Applications: Complete processing of silver halide emulsions.
Both normal and reversal.
Controller: Keyboard command controller.
Spin speeds 100 to 2000 RPM +/-5 percent in nine increments.
Process Mechanism: Dispensing systems for 2 developers, bleach,
fixer, wetting agent and DI water. 110V, 50/60 Hz.
Inventory#:
31341 View
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WET BENCH -
Spray Etch System:
Filtered etch temperature controller.
Touchscreen monitor.
Plastic aerated tank 8 1/2 in. W x 16 in. L x 9 in. D.
Interlocked automated teflon etch compartment.
Inventory#:
28279 View
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DELTA DESIGN -
2850C:
Temperature Chamber.
Analog control.
Temp. Range: -73 to 315 deg. C.
Inside Chamber Dimensions: 7 in. H x 16 in. W x 7 in. D.
120V, 60Hz, 20A.
REQUIRES CO2 FOR COOLING.
Inventory#:
32554 View
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DIANO -
XRD-8760:
X-Ray Spectrometer.
Employs a flat crystal to reflect the measurement of characteristic x-ray spectra
emitted by a specimen.
The spectrometer consists of a four-position crystal chamber and a position sample changer.
The spectrometer has a Model EA-75 dual target.
Tungsten, Chromium, 75 kV peak x-ray tube.
With Diano XRD 8537 Electronics Cabinet, including a DEC PDP 11/03 computer.
With GE 7.5 kV Isolation Transformer and 5 kV Stabilizer.
With Hydraulic Pump.
220/240V, 60 Hz.
Inventory#:
21980 View
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PHILIPS -
PW1410/70:
X-Ray Fluorescence Spectrometer.
With XRG-3000 X-Ray Generator and Data processor.
Scanning range: Scintillation counter from 0 deg. to 116 deg. (2 theta).
Flow counter from 0 deg. to + 148 deg. (2 theta).
Reading accuracy: 0.005 deg. (2 theta).
Reproducibility: 0.003 deg. (2 theta).
Maximum sample thickness: 42mm (1 5/8 in.).
Maximum sample diameter: 2 in. (50.8 mm).
Sample rotation: 60 rpm.
Power Requirements - Voltage: 195V min. to 245V max.
Frequency: 60 Hz.
Output Characteristics - Voltage range: Output is variable
from 15kV to 60kV at 80 mA DC or less as limited by 3kW max. output power.
Output voltage: Output voltage is full wave rectified and filtered.
Inventory#:
25410 View
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ASM -
EPITAXY:
EPI Reactor Loader.
Built to interface EPI Reactor with a Smith Interface.
Accufab Systems Model 1250 series robot and controller module.
5 1/4 in. disk drive.
(2) 8 in. cassettes.
Inventory#:
14062 View
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DIANO -
Match Scan II:
Color Spectrophotometer.
Color measuring instrument.
Sample measurement continuously adjustable from 20mm to 5mm. Wavelength: 380-700nm.
Bandwidth: 10nm.
Measurement Time: 16 point data: 9 sec.
161 point data: 42 sec.
120/240 V, 50/60 Hz.
Inventory#:
13983 View
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EG&G -
1451:
Plasma Monitor w/Jarrell Ash Spectrometer and a 1454 Detector.
The most sensitive 1451 system detector is the Model 1454a 512-channel intensified diode array providing detection levels of approximately 100 photons per A/D count.
The wavelength response of the 1454 is limited by the intensifier to the range of 365 nm to 800 nm.
Inventory#:
23652 View
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SPECIALTY COATING SYSTEMS -
DEGEN III:
MAP UV Curing System.
Total of 6 UV lamps.
Track size: 3.5 in. conveyorized track.
Main unit: Intelmatec.
With controller and power supply.
Inventory#:
25144 View
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All items are covered by our 30-Day Right of Return and 3-Month Warranty
unless otherwise stated. For full details of this policy,
click here!
Note: All
manufacturers names and models are used for illustrative purposes only.
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the manufacturer. Unless otherwise stated, all items are used, and
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and may not be used for any purpose without prior written permission
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AG ASSOCIATES -
610:
Rapid Thermal Processor.
Benchtop system for rapid thermal processing of semiconductor wafers up to 6 in. dia. max.
(depends on wafer tray with system).
Programmable ramp up rates.
Peak temperature: 1350 deg C.
Recommended steady state temperature range: 400 to 1150 deg C.
Inventory#:
54116 
