Used and Refurbished Semiconductor Wafer Bonding Equipment
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DAGE
BT 25
-
$950 AS IS
DAGE -
BT 25:
Automatic Wirebond Tester.
Offers the benefit of full microprocessor control, to ensure 100 percent testing of up to 15,000 discrete points per substrate. Easily programmed using alphanumeric keyboard and liquid-crystal display, the Series 25 meets the requirements of MIL-STD-883 with a speed of (less than 2 sec. per wire), precision (+/- 5 micro-meters), and consistency +/- 10 micro-meters).
Inventory#:
27304 View
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SHINKAWA -
SWB-FA-US-30:
Automatic Wire Bonder.
Aluminum wedge wire bonder for low to high lead-count devices with different configuration.
Wedge stroke: Capable of clearing the protuberance 7.5mm high
at maximum from the device surface.
Overall bonding accuracy of +/- 10 micrometers realized by the upgrading
of both the pattern recognition and mechanical accuracy.
Bonding Method: Ultrasonic (pull-cut) wedge bonding.
Pattern recognition time: within 0.25 sec. (2-point alignment).
Recognition range: XY: + 0.23 mm. q: +5 deg. Recognition accuracy: 3.7 mm.
Bonding area: X: 20 mm, Y: 20 mm.
Sold As Is.
Inventory#:
25630 View
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SHINKAWA -
SDP-FA-TAPE 1:
System automatically takes die from a waffle pack and seals them on a tape and reel.
Sold As Is.
Inventory#:
31051 View
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SHINKAWA -
SDP-FA-4.1:
Fully Automatic Die Pick & Place Machine.
Automatically detects and picks up only good dice from probed and
diced wafers and neatly place them on a die tray.
Maximum wafer 6 in. dia.
Wafer ring size 194mm dia.max.
Accuracy of die pickup +/- 200 mm in X and Y directions.
Sold As Is.
Inventory#:
31054 View
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ZMATION -
Z 1416:
Flip Chip Underfill.
Dispensing System.
UPGRADED BY MANUFACTURER, VERY NICE CONDITION.
Sold As Is.
Inventory#:
33429 View
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EPE TECHNOLOGY -
20/20:
Pick and Place.
Completely self contained, programmable, computer controlled,
four axis, single head pick and place printed circuit board assembly system.
All surface mount components with a flat top
surface of at least .040 in. square can be accommodated.
Small pitch gull wing devices, 100 pin or 132 pin .8mm, .65mm,
or .25 in. are especially a forte of the 20/20.
Sold As Is $2,950. Working with 30 day right of return $9,500.
Inventory#:
29473 View
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MRSI -
501:
Vision Guided Automated Die Placement System.
Menu-driven software.
Recognizes and places randomly oriented dies.
Substrate misalignment compensation.
Placement rate 400 dies/hr. or better w/vision 900 dies/hr. direct placement.
Placement accuracy plus or minus .003 in.
Sold As Is.
Inventory#:
30063 View
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ASECO -
S-200:
Pick and Place Tri-Temp Test Handler.
Designed to accommodate IC packages in trays.
Permits quick changeover of conversion kits for a variety of advanced component types including QFP, BGA, PGA, TSSOP and PLCC packages.
11 x 11 CPBA package accommodation kit.
JEDEC universal tray adaption kit (Type III).
Temperature chamber screen assembly.
Ultra ENT2, M2300, 512MB, 4.2GB.
Mfg.:1997. Excellent Condition.
Inventory#:
39571 View
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KTC -
BT-30:
Bond/Shear Tester.
Microprocessor controlled combination die and ball bond shear tester.
The Bondtest 30 performs destruct and non-destruct testing.
Test results are displayed on a peak hold digital read-out meter.
Plug-in force transducers may be simply interchanged to accommodate differing force requirements.
Inventory#:
42635 View
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ESEC -
3018 AWB:
Automated Gold Ball Bonder.
Flying bondhead operates by means of a frictionless air bearing.
System has programmable focus option.
E-Stop and Venturi vacuum.
2 in. x 2-1/2 in. work table travel.
Programmable X-Y-Z indexer. Currently 80 micron machine but upgradable to 65 micron.
Installation and custom configurations available at added cost.
Inventory#:
46614 View
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K&S -
8060:
Automatic Wedge Bonder.
Bonding speed of up to 5.5 wires per sec.
Bonds with gold, aluminum and copper wire so you can select the best solution for your process.
System will require K&S calibration, set up and site license at customers expense!
Inventory#:
46216 View
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LAURIER -
HA 225 Plus:
Hybrid Epoxy Die Bonder.
Active or passive components: 0.010 to 0.400 in.
Motor driven stage: 4-1/2 in. x 16 in. for product presentation.
Epoxy syringe and dip PC Controller. Sold As Is.
Inventory#:
31692 View
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MECH EL -
827:
Hybrid Ball Bonder.
Controlled flame off and unique tail puller produce repeatable
ball sizes: 2 mil ball with 1 mil wire. 6:1 microprocessor.
Multi-level bonding.
Manual Z-arm operation.
No work holder at this price.
115V, 60 Hz.
Inventory#:
49233 View
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ROYCE -
SYSTEM 550:
Bond Test System.
Built-in PC controller.
Automatic tool touch sense and programmable tool height.
All test types can be performed as non-destructive tests.
Currently configured with shear test load cell.
120V, 60 Hz.
Inventory#:
49231 View
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DAGE -
MF-22A:
Wire Pull Tester.
Designed for destructive or non-destructive bond strength testing.
Microprocessor controller with alphanumeric display.
Built in printer.
Sterozoom Microscope.
Inventory#:
49227 View
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K&S -
4123:
Manual Wedge Bonder.
Raised work area, no heated work holder.
Aluminum or gold wire wedge bonder.
Wire Diameter: 0.5 to 3.0 mil for gold. 1.0 to 3.0 for aluminum.
115V, 60 Hz.
Inventory#:
49271 View
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LAURIER -
SA220:
Liquid Transfer System.
Provides reproducible depositions as well as die pick up and placement.
Extremely fast set-up times. 120V, 60 Hz.
Inventory#:
49205 View
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MECH EL -
907:
Manual Wedge Bonder.
UTHE dual channel ultrasonic power supply.
Heated transducer.
Wire capability: .5 to 3 mil, requires minor changes for heavy wire.
6:1 micromanipulator.
No work holder or stage.
115V, 60 Hz, 3A
Inventory#:
49269 View
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MRSI -
MRSI 170:
Automated High Prescision Epoxy Dispenser.
System automatically aligns the substrate pattern, profiles the substrate heights,
cleans the dispensing tip and purges the needle before starting to dispense.
Capable of dispensing dots as well as continuous lines and areas.
Inventory#:
49567 View
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MECH EL -
907:
Wedge Bonder.
For use with gold or aluminum wire from .5 mil to 3 mil. No work holder.
Stereozoom Microscope with high intensity lighting.
30 degree wire feed with 2 in. spool.
Heated transducer.
Damped Manual Z-Arm with Z-Rotor. Stitch button.
115V, 60 Hz.
Inventory#:
40279 View
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LAURIER -
CP-222:
Chip Placement System for use with Pre-Screened Adhesives.
Ideal for LED’s and multiple chip placement on
hybrids where epoxies or gold pastes are prescreened on the substrate.
Inventory#:
49910 View
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K&S -
4123:
Universal Wedge Bonder.
An aluminum or gold wire bonder versatile enough to bond simple ICs
and discrete devices or complex hybrids with height variations up to 200 mils.
With spotlight target option.
Wire Diameter Range: Gold 0.5 to 3.0 mil., Aluminum 1.0 to 3.0 mil. 120V, 60 Hz.
No Work Holder.
Inventory#:
44064 View
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MECH EL -
907:
Manual Wedge Bonder.
For use with gold or aluminum wire from .5 mil to 3 mil. Includes optional heated work holder.
Bausch & Lomb stereozoom microscope with illuminator.
115V, 60 Hz, 3A.
Inventory#:
50307 View
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MECH EL -
703:
Eutectic Die Attach System.
Designed for eutectic die attaching with or without preforms.
Manual Z-lever control.
Heated work holder.
StereoZoom microscope.
115V, 60 Hz.
Inventory#:
50372 View
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MECH EL -
907T:
Manual Wedge Bonder.
For use with gold or aluminum wire from .5 mil to 3 mil.
Includes heated work holder.
Stereozoom microscope.
X-Y control over 1 in. x 1 in. area.
110V, 60 Hz, 3A.
Inventory#:
50608 View
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MRSI -
MRSI 170:
Automatic Liquid Dispenser.
Highly accurate inline dispensing system with two dispense heads.
Menu driven software directs operator through each step.
Inline track handling system for integration to other tools.
100/240V, 50/60 Hz, 6A, CE.
Inventory#:
50964 View
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MECH EL -
907:
Manual Wedge Bonder.
Ultrasonic wedge bonder.
Wire capability: .5 to 3 mil.
Damped manual Z arm.
Stereozoom microscope.
No work holder at this price.
115V, 60 Hz.
Inventory#:
51274 View
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MECH EL -
907:
Manual Ultrasonic Wedge Bonder.
Manual wire bonder.
Wire capability: .5 to 3 mil.
Manual Z arm.
No work holder at this price.
115V, 60 Hz.
Inventory#:
51275 View
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MEI -
779P:
Epoxy Die Bonder.
Vacuum pick-up tool and epoxy dispense head.
Just what is in the photo, no die holders.
115V, 60 Hz, 5A.
Inventory#:
51797 View
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LAURIER -
SA-220E:
Epoxy Die Bonder.
Rotary heads for stamping and die pick up.
Provides reproducable depositions as well as die pick up and placement.
220V, 50/60 Hz.
Inventory#:
51815 View
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HUGHES -
WD-16500-003:
Programmable Reflow Solder Power Supply.
LCD display of solder schedule time and temperature settings.
Offers step by step programming instructions.
115V, 50/60 Hz, 8A.
Inventory#:
52012 View
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ORTHODYNE -
20B:
Ultrasonic Large Wire Bonder.
Semiautomatic operation, automatic adjustable looping and stepback
produce uniform loop heights for more consistent, higher quality bonds.
Wire Size: 4 to 20 mil.
115V, 50/60 Hz.
Inventory#:
52136 View
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MECH EL -
907:
Wedge Bonder.
For use with gold or aluminum wire from .5 mil to 3 mil.
With optional heated work holder and digital controller.
Stereozoom Microscope with high intensity lighting.
30 degree wire feed with 2 in. spool.
Heated transducer.
Damped Manual Z-Arm with Z-Rotor.
Stitch button. 115V, 60 Hz.
Inventory#:
39112 View
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MECH EL -
779:
Epoxy Die Bonder.
Vacuum pick up tool.
Epoxy dispense head.
Bausch & Lomb StereoZoom microscope.
115V, 60 Hz.
Inventory#:
52364 View
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LOGITECH -
BC3000:
3 Station Vacuum Bonding System.
Bonds fragile materials such as GaAs, InP or silicon.
Can be used to mount whole or part wafers up to 4 in. dia.
Will produce consistently high standards of wafer to wafer support disk parallism.
Includes vacuum pump.
Inventory#:
42900 View
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ORTHODYNE -
M20:
Ultrasonic Heavy Wire Bonder.
Automatic adjustable looping and stepback produce uniform loop heights for high quality bonds.
Bonds 4 to 20 mil wire.
Semiautomatic and manual modes.
110V, 50/60 Hz.
Inventory#:
52488 View
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SEMICONDUCTOR EQUIPMENT -
410X:
Flip Chip Die Bonder.
Aligns and attaches flip chip die onto various substrates.
Granite table with granite risers.
Alignment accuracy is +/- 5 microns.
PC controller.
Inventory#:
52615 View
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K&S -
4123:
Universal Wedge Bonder.
An aluminum or gold wire bonder versatile enough to bond simple ICs
and discrete devices or complex hybrids with height variations up to 200 mils.
Wire Diameter Range: Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60Hz.
NO WORK HOLDER.
Inventory#:
52620 View
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ROYCE -
SYSTEM 550:
Universal Bond Test System.
Universal strength testing system for evaluating micro-electronic structures.
Currently configured with ASTM-200, 200 gr. shear test load cell.
120V, 50/60 Hz.
Inventory#:
52631 View
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SEMICONDUCTOR EQUIPMENT -
410:
Flip Chip Die Bonder.
Aligns and attaches flip chip die onto various substrates.
Versatile processing capabilities allow for tacking die in place for
subsequent reflow or for complete attachment on the heated work stage.
Comes with only one die tray holder.
Motorized Stage Travel: 6 in.
Computer controlled 350 deg C heated stage.
Cube beam splitter alignment.
Die Size: 0.010 to 1.000 in. sq.
Inventory#:
52745 View
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MECH EL -
827:
Hybrid Ball Bonder.
Controlled flame off and unique tail puller produce repeatable ball sizes: 2 mil ball with 1 mil wire.
6:1 microprocessor. Multi-level bonding.
Manual Z-arm operation.
No work holder at this price. 115V, 60 Hz.
Inventory#:
52964 View
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K&S -
1488 Plus:
Automatic Gold Ball Bonder.
Computer controlled system Graphic displays and interactive display.
CALL FOR DETAILS. Sold As Is. NO MICROSCOPE.
Inventory#:
38257 View
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K&S -
8028:
Automatic Ball Bonder.
The standard in speed and fine pitch.
43 micron bonded ball production process.
Fully programmable material handling system.
Graphical user interface.
Date of Mfg.: 2000.
Inventory#:
53252 View
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SEMICONDUCTOR EQUIPMENT -
83A:
Semiautomatic Pick and Place System.
Die or other small packages can be picked from one location and placed at another.
5 in. x 10 in. free floating worktable is manipulated between pick and place positions with the front control handle.
115V, 50/60 Hz, 1.5A.
Inventory#:
53549 View
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ROYCE -
System 110:
Epoxy Die Bonder.
Places die onto snapstrates, multiple substrate arrays, hybrids and single chip packages.
Quick change programmable placement setups. Picks multiple die types from chiptrays, Gel Paks, mirror trays, etc.
Precision 10:1 manipulator for die rotation and fine positioning.
Setups stored in non-volatile memory.
Height control for building multi-layered devices.
Inventory#:
53571 View
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SEMICONDUCTOR EQUIPMENT -
83A:
Semiautomatic Pick and Place System.
Die or other small packages can be picked and placed onto any desired package.
Epoxy dispense can be added.
Manual X-Y precision slide table with 5 in. x 10 in. of travel.
115V, 50/60 Hz, 1.5A.
Inventory#:
53578 View
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All items are covered by our 30-Day Right of Return and 3-Month Warranty
unless otherwise stated. For full details of this policy,
click here!
Note: All
manufacturers names and models are used for illustrative purposes only.
Any trademarks, tradenames or copyrights remain solely the property of
the manufacturer. Unless otherwise stated, all items are used, and
Bid-Service is not a manufacturer authorized representative. All images
are copyright 2001-2010 Bid-Service LLC/Sci-Quip and may not be used for
any purpose without prior written permission
DAGE -
4000 PAXY:
Series 4000 Bond Tester. More information to come contact us for details.
Inventory#:
55512 
