MEYER BURGER -
TS-116:
Slicing Machine.
Controller: GE Fanuc Series O-M. MFG. 1989.
For automatic slicing of ceramic materials, ferrite, quartz, optical glass.
Slicing blade dia. 100-150 mm.
1 fixed spindle speed range from 2500-8000 RPM.
Longitudinal path:300 mm
Cross path: 140 mm.
Vertical path: 100 mm.
Resolution in all 3 axes: 0.001 mm.
Feed speeds programmable from 5-2000 mm/min.
Workable: 300 x 150 mm.
Distance spindle axis workable:50-150 mm.
Inventory#:
26880 View
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DISCO -
DAC-2SP/86:
Automated Dicing Saw.
Max. Substrate Size: 150 mm.
Range of Indexing: 0.0001 to 99.9999 mm.
Minimum Step Indexing: 0.00025 mm.
Spindle Rotation: 3000 to 40,000 rpm.
Older dicing saw but in good condition.
Inventory#:
38633 View
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MICRO AUTOMATION -
M3600:
Tape Frame Applicator with Camera and Monitor for Alignment.
Vacuum hold down of wafers up to 6 in. dia.
Roller applies pressure to tape frame to remove bubbles and help with adhesion.
Inventory#:
39015 View
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ADVANCED IMAGING INC. -
ROUGH LAP STATION:
Polishing System.
Heavy duty polishing system.
18 in. dia. polishing wheel capable of holding 4 specimen rings.
Digital RPM readout. Motor timer. 115V, 60 Hz.
Inventory#:
55418 View
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SAS -
PACM 250:
Hard Material Dicing Saw.
Diamond wheel cuts material on a 6 in. dia. vacuum chuck.
Digital readout of X and Y axis.
Manual control of index.
Motorized cut feed.
200/220V, 3 Ph, 60 Hz.
Inventory#:
47124 View
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TOKYO SEIMITSU -
S-LM-116G:
Vertical Slicing Machine with ID Diamond Blade
Electronically controlled slicing machine produces quality wafers
by precisely cutting an ingot of brittle materials with an ID diamond blade.
Blade size OD: 422 mm, ID: 152 mm.
Acceptable Ingot Size: Max. 100 mm x 350 mm L.
Includes oil mist separator.
220V, 3 Ph, 60 Hz.
Inventory#:
47251 View
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MTI -
NSX-250:
Dicing System.
For dicing silicon, gallium arsenide, glass, ceramics and other brittle materials.
Windows-reg.TM based CNC controls.
Direct drive overarm supported 4 in. air spindle variable speeds: 15,000 to 40,000 rpm.
Resolution X (feed) 0.100 micro-meters, Y (index) 0.100 micro-meters, Z (vertical) 0.100 micro-meters.
Vacuum chuck.
Table feed travel: 406 mm.
Inventory#:
47400 View
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K&S -
775:
Wafer Dicing Saw.
Older saw, but being sold tested and in good working condition.
2 in. dia. spindle.
Cutting Range: 0 to 6 in.
Stroke: 10.5 in.
Inventory#:
50804 View
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VILLA PRECISION -
GS-210:
Automatic Single Head Precision Glass Scriber.
Capable of scribing substrates as large as 14 in. x 16
Scribe action is dual direction, left to right or right to left.
The glass is held in place by a vacuum stage.
Vacuum stage rotates to 90 degrees for scribes in the second axis.
Programmable Resolution: 0.0002 in.
120V, 60 Hz.
Inventory#:
51299 View
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STRUERS -
ACCUTOM:
Universal Precision Cut-Off Machine.
Variable cutting speed.
Works with cut-off wheels 50-200 mm dia.
115V, 50/60 Hz.
Inventory#:
51690 View
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LOGITECH -
BC3000:
3 Station Vacuum Bonding System.
Bonds fragile materials such as GaAs, InP or silicon.
Can be used to mount whole or part wafers up to 4 in. dia.
Will produce consistently high standards of wafer to wafer support disk parallism.
Includes vacuum pump.
Inventory#:
42900 View
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K&S -
982-6 Plus:
Precision Dicing Saw.
Process parameters are totally programmable through interactive menu-driven screens.
For wafers up to 6 in. in diameter.
2 in. air bearing spindle with a maximum speed of 40,000 rpm.
Date of Mfg.: 2000.
208V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
52485 View
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ADVANCED DICING TECHNOLOGIES -
982-6:
Precision Dicing Saw.
Automated process control.
Optimal combination of kerf quality, throughput and yield.
For wafers up to 6 in. dia. 2 in. dia. spindle with programmable speed from 4,000 rpm to 40,000 rpm.
Video viewing of alignment and cutting.
Date of Mfg.: 6/2004. 208V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54880 View
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ADVANCED DICING TECHNOLOGIES -
982-6:
Precision Dicing Saw.
Precision dicing, cutting and slotting for the semiconductor and microdevices industries.
Process parameters are totally programmable
through interactive menu-driven screens. 6 in. dia. vacuum chuck.
Air bearing spindle with 2 in. dia. blade and maximum speed of 40,000 rpm.
Video viewing of alignment and cutting.
Date of Mfg.: 9/2004.
Inventory#:
54731 View
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DISCO -
DAD521:
Automatic Dicing Saw.
Designed to cut brittle materials such as silicon wafers, glasses and ceramics.
Can accommodate wafers from 3 in. to 6 in.
Cutting Range: Circle: 0.01 to 160.00 mm. Square: 0.01 to 220.00 mm.
Vacuum Chuck: 6-1/4 in. dia.
4-Axis Index Setting Range: 0.0001 to 160.0000 mm, Min. Step: 0.2 micrometers.
Air bearing spindle programmable 3,000 to 40,000 rpm, water cooling.
200V, 3 Ph, 50/60 Hz.
Inventory#:
53305 View
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STRUERS -
ABRAMATIC:
Microprocessor Controlled High Capacity Grinding and Polishing Machine.
Automatic specimen preparation of almost any material by pre-programmed methods.
Six fixed and four open programs allow user programmed or standard programs to be used.
300 mm polishing wheel speed: 150/300 rpm.
Specimen holder speed: 150 rpm reversible.
Vertical grinding force: 50-700 N.
440V, 3 Ph, 60 Hz.
Inventory#:
51703 View
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LOGITECH -
AXL1:
Precision Annular Saw.
Designed for the fine cutting of a wide range of hard or friable materials.
Accepts sample sizes up to 40 mm dia.
Minimal kerf loss and cutting damage.
Slice thickness control 25 mm in 10 micrometer increments.
110V, 60 Hz, 3A.
Inventory#:
53477 View
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LOGITECH -
GI 20:
High Precision Flatness Measurement System.
Suitable for lapped and polished surfaces up to 150 mm dia.
This grazing incidence interferometer allows rapid and accurate measurements
to be made “in process” and displays the interogram on a 7 in. CRT.
110V, 60 Hz, 1.6A.
Inventory#:
53476 View
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DYNATEX -
GST-150:
150mm Scriber Breaker. Capable of completely and automatically scribing and breaking many substrate materials. Alternative method to saw dicing for up to 6in. silicon and GaAs applications. Fully programmable for all scribing and breaking parameters.
Stored process eliminates operator adjustments when changing between wafer types.
Max. wafer size 150mm, wafer thickness 40 to 1725 micrometers. Minimum Die Size: 200 micrometers sq. 100/240V,1 Ph, 50/60 Hz, 10/5A,CE.
Inventory#:
53500 View
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DYNATEX -
DX-III:
Scriber Breaker.
Fully programmable for all scribing and breaking parameters.
Wafers up to 39 mils thick can be processed, as well as die 5 mils sq.
Fully programmable for edge, skip and continuous wafer scribing.
Scribe angle is programmable in 0.1 degree increments.
Can be used for substrates up to 4 in. dia.
120V, 60 Hz, 5A.
Inventory#:
53522 View
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LOGITECH -
VS2:
Vacuum System with Water Trap.
Vacuum pump and water separator for Logitech polishers.
Two port system. 115V, 50/60 Hz.
Inventory#:
53597 View
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K&S -
7100 AD:
Precision Dicing Saw.
Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield.
Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed.
Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in.
Spindle speed programmable up to 60,000 rpm.
200/240V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54881 View
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SEMICONDUCTOR EQUIPMENT -
2800:
4 in. Substrate Automatic Scriber.
Extremely rugged and accurate diamond scriber with automatic indexing,
in .0005 increments, for die sizes to .9995 and wafer sizes to 4 in. dia.
115V, 60 Hz, 4.5A.
Inventory#:
54938 View
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DYNATEX -
GST-150:
150mm Fully Programmable Scriber Breaker.
Designed to increase yield and provide superior processing speeds.
Windows® operating environment provides a fast user friendly interface.
Zero kerf loss allows higher die density on wafer.
Fully programmable for all scribing and breaking parameters including TrueAngleTM diamond
tool positioning. Currently configured for 6 in. dia. tape rings and up to 4 in. dia. wafers.
Can be retooled to do up to 150mm wafers.
100-240V,1 Ph,50/60 Hz,10/5A, CE.
Inventory#:
55263 View
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MICRO AUTOMATION -
M-1006A:
Programmable Dicing Saw.
Split-field video alignment optics.
Capable of dicing up to 150 mm dia. substrates.
Air bearing 2 in. spindle with an adjustable speed from 10,000 to 40,000 rpm.
Older system but selling in good working condition.
115V, 60 Hz.
Inventory#:
53913 View
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K&S -
7100 AD:
Precision Dicing Saw.
Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield.
Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed.
Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in.
Spindle speed programmable up to 60,000 rpm.
200/240V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54804 View
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K&S -
982-6 Plus:
Precision Dicing System.
Precision dicing saw for samples up to 6 in. x 6 in.
Process parameters are totally programmable through interactive menu-driven screens.
2 in. air bearing spindle with a speed of 4,000 to 40,000 rpm.
Currently configured with vacuum chuck for square samples up to 6 in. x 6 in.
208V, 1 Ph, 50/60 Hz.
Date of Mfg.: 10/99.
Inventory#:
54172 View
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K&S -
7100 AD:
Precision Dicing Saw.
Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield.
Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed.
Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in.
Spindle speed programmable up to 60,000 rpm.
200/240V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54818 View
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K&S -
7100 AD:
Precision Dicing Saw.
Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield.
Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed.
Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in.
Spindle speed programmable up to 60,000 rpm.
200/240V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54884 View
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ADVANCED DICING TECHNOLOGIES -
982-6:
Precision Dicing Saw.
Automated process control. Optimal combination of kerf quality, throughput and yield.
For wafers up to 6 in. dia. 2 in. dia. spindle with programmable speed from 4,000 rpm to 40,000 rpm.
Video viewing of alignment and cutting.
Date of Mfg.: 6/2004. 208V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54883 View
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K&S -
7100 AD:
Precision Dicing Saw.
Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield.
Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed.
Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in.
Spindle speed programmable up to 60,000 rpm.
200/240V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54894 View
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SPEEDFAM -
CHEK-FLAT:
Optical Flatness Measuring System.
Devised for optically measuring flatness on non-reflective surfaces in the “problem” range of 0.0001 in. to .100 in.
Without fixturing or calibration, the unique Chek-Flat pattern shows where and by how much a surface is out-of-flat. No anvils.
Inventory#:
54458 View
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DYNATEX -
DX-II:
Wafer Breaker.
Breaks either diamond or saw scribed wafers up to 2 in. dia.
120V, 60 Hz.
Inventory#:
54555 View
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K&S -
982-6:
Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6 in. dia. vacuum chuck.
Air bearing spindle with 2 in. dia. blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting.
Inventory#:
55022 View
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unless otherwise stated. For full details of this policy,
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ADVANCED IMAGING INC. -
ROUGH LAP STATION:
Polishing System.
Heavy duty polishing system.
18 in. dia. polishing wheel capable of holding 4 specimen rings.
Digital RPM readout. Motor timer. 115V, 60 Hz.
Inventory#:
55418 
