Used and Refurbished Epoxy Wafer Bonding Equipment
Browse/Search by Keyword(s): epoxy
LAURIER
HA 225 Plus
-
$2,500 AS IS
LAURIER -
HA 225 Plus:
Hybrid Epoxy Die Bonder.
Active or passive components: 0.010 to 0.400 in.
Motor driven stage: 4-1/2 in. x 16 in. for product presentation.
Epoxy syringe and dip PC Controller. Sold As Is.
Inventory#:
31692 View
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MRSI -
MRSI 170:
Automated High Prescision Epoxy Dispenser.
System automatically aligns the substrate pattern, profiles the substrate heights,
cleans the dispensing tip and purges the needle before starting to dispense.
Capable of dispensing dots as well as continuous lines and areas.
Inventory#:
49567 View
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MEI -
779P:
Epoxy Die Bonder.
Vacuum pick-up tool and epoxy dispense head.
Just what is in the photo, no die holders.
115V, 60 Hz, 5A.
Inventory#:
51797 View
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LAURIER -
SA-220E:
Epoxy Die Bonder.
Rotary heads for stamping and die pick up.
Provides reproducable depositions as well as die pick up and placement.
220V, 50/60 Hz.
Inventory#:
51815 View
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MECH EL -
779:
Epoxy Die Bonder.
Vacuum pick up tool.
Epoxy dispense head.
Bausch & Lomb StereoZoom microscope.
115V, 60 Hz.
Inventory#:
52364 View
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ROYCE -
System 110:
Epoxy Die Bonder.
Places die onto snapstrates, multiple substrate arrays, hybrids and single chip packages.
Quick change programmable placement setups. Picks multiple die types from chiptrays, Gel Paks, mirror trays, etc.
Precision 10:1 manipulator for die rotation and fine positioning.
Setups stored in non-volatile memory.
Height control for building multi-layered devices.
Inventory#:
53571 View
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LAURIER -
SA-202:
Epoxy Die Bonder.
Rotary heads for stamping and die pick-up.
Provides reproducible depositions as well as die pick-up and placement.
220V, 50/60 Hz.
Inventory#:
53582 View
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LAURIER -
SA-202:
Epoxy Die Bonder.
Provides fast, highly accurate chip placement and bonding.
Counter balanced and adjustable die pick-up arm.
Bausch & Lomb StereoZoom microscope.
Inventory#:
53779 View
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unless otherwise stated. For full details of this policy,
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manufacturers names and models are used for illustrative purposes only.
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