Used and Refurbished Semiconductor Wafer Grinding Equipment
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BUEHLER
DUOMET II
$2,750
BUEHLER -
DUOMET II:
Belt Surfacer for Two Step Coarse Grinding.
Built in flushing systems.
1/2 hp heavy duty motor.
Two belt system 4 in. x 9 in. grinding area.
115V, 60 Hz, 10.8A, CE.
Inventory#:
55411 View
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ADVANCED IMAGING INC. -
ROUGH LAP STATION:
Polishing System.
Heavy duty polishing system.
18 in. dia. polishing wheel capable of holding 4 specimen rings.
Digital RPM readout. Motor timer. 115V, 60 Hz.
Inventory#:
55418 View
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LOGITECH -
BC3000:
3 Station Vacuum Bonding System.
Bonds fragile materials such as GaAs, InP or silicon.
Can be used to mount whole or part wafers up to 4 in. dia.
Will produce consistently high standards of wafer to wafer support disk parallism.
Includes vacuum pump.
Inventory#:
42900 View
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BUEHLER -
HANDIMET II:
Roll Grinder for Fine Grinding of Metallographic Specimens.
Efficient four-stage fine grinding with controlled water flow for lubrication and flushing.
Four 3-7/16 in. x 11-1/2 in. grinding surfaces. No moving parts.
Inventory#:
55214 View
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SPEEDFAM -
CHEK-FLAT:
Optical Flatness Measuring System.
Devised for optically measuring flatness on non-reflective surfaces in the “problem” range of 0.0001 in. to .100 in.
Without fixturing or calibration, the unique Chek-Flat pattern shows where and by how much a surface is out-of-flat. No anvils.
Inventory#:
54458 View
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