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Used and Refurbished Semiconductor Wafer Grinding Equipment

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BUEHLER  DUOMET II

NEW ARRIVAL!!

$2,750
BUEHLER - DUOMET II:  Belt Surfacer for Two Step Coarse Grinding. Built in flushing systems. 1/2 hp heavy duty motor. Two belt system 4 in. x 9 in. grinding area. 115V, 60 Hz, 10.8A, CE.          Inventory#: 55411
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ADVANCED IMAGING INC.  ROUGH LAP STATION

NEW ARRIVAL!!

$4,500
ADVANCED IMAGING INC. - ROUGH LAP STATION:  Polishing System. Heavy duty polishing system. 18 in. dia. polishing wheel capable of holding 4 specimen rings. Digital RPM readout. Motor timer. 115V, 60 Hz.          Inventory#: 55418
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LOGITECH  BC3000

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$9,500
LOGITECH - BC3000:  3 Station Vacuum Bonding System. Bonds fragile materials such as GaAs, InP or silicon. Can be used to mount whole or part wafers up to 4 in. dia. Will produce consistently high standards of wafer to wafer support disk parallism. Includes vacuum pump.          Inventory#: 42900
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BUEHLER  HANDIMET II

NEW ARRIVAL!!

$750
BUEHLER - HANDIMET II:  Roll Grinder for Fine Grinding of Metallographic Specimens. Efficient four-stage fine grinding with controlled water flow for lubrication and flushing. Four 3-7/16 in. x 11-1/2 in. grinding surfaces. No moving parts.          Inventory#: 55214
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SPEEDFAM  CHEK-FLAT

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$3,250
SPEEDFAM - CHEK-FLAT:  Optical Flatness Measuring System. Devised for optically measuring flatness on non-reflective surfaces in the “problem” range of 0.0001 in. to .100 in. Without fixturing or calibration, the unique Chek-Flat pattern shows where and by how much a surface is out-of-flat. No anvils.          Inventory#: 54458
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