Used and Refurbished Semiconductor Processing Photoresist Equipment
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TEGAL
900E
-
$29,000
TEGAL -
900E:
Cassette to Cassette Photoresist Strip/Backside Etching.
Spatula wafer transport from cassette to cassette.
Users are guided through programming and
operation by menu-driven software and soft-keys
via a built in display and an external terminal.
System is currently configured for 4 in. wafers.
Inventory#:
33748 View
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SVG -
90 Series:
UV Coat & Develop Tracks.
Configured for 200 mm wafers. 4 Elevators Model 90211S.
Two track system one side with 3 develop stations and one side with 2 coat stations.
Glass enclosure with HEPA filtered hood, ion system static control, Semifab RAM 3500 environmental control unit and a Donaldson high purity products counter-flow adsorber module.
Two tank chemical cabinet with 4 DI water tanks and pumps.
Stepper interface module.
Top and bottom edge bead removal.
Spatula transfer arms between bake and chill plates.
Backside wash on develop station.
Modules (1)-57185, (2)-9037, (4)-9044, (2)-9026, (1)-9038, (3)-9036, (3)-9032.
SOLD AS IS.
Inventory#:
34337 View
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TEGAL -
900E:
Cassette to Cassette Single Wafer Photoresist Stripper.
Low particulate spatula handling system.
System configured for 4 in. wafers.
CRT with process graphics.
ENI 13.56 MHz RF Generator.
With roughing pump.
Inventory#:
37628 View
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SVG/SITE SERVICES -
8632CTD/8636HPO:
Developer-Exposure Track.
Single track developer configured with 2 elevators, one spinner and one bake.
System has an OAI 0130-042-20 deep UV.
220 nanometer exposure tower capable of up to 2000W.
Currently configured for 4 in. wafers.
Inventory#:
41192 View
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SVG -
8626 PC:
Cassette to Cassette Single Track Photoresist Coater.
Model 8626 PC/8636 HPO programmable controller.
Configuration: Elevator - Spin Coater - Elevator.
System can be configured for wafers up 6 in. dia.
Inventory#:
40115 View
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FAS TECHNOLOGIES -
MicroE™ 200:
Extrusion Coating System.
Uses high precision extrusion technology to coat materials in a wide range of viscosities.
Coats very thick layers (100 micrometers) in a single step. Repeatable digitally programmed process.
Greater material utilization than spin coating (typical 75 percent of dispensed material remains on the wafer).
Inventory#:
42576 View
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FAS TECHNOLOGIES -
MicroE™ 200:
Cassette to Cassette Extrusion Coating System with Stacked Bake/Chill Oven.
System is capable of coatings over 100 micron thick in one process step
with uniformities surpassing +/- 2 percent.
Material utilization is 75 percent compared to 5-10 percent for spin coating.
This means lower cost of material and reduced expense of waste disposal.
Increased process uniformity.
Uses high precision extrusion technology.
Ability to coat materials in a wide range of viscosities.
Repeatable digitally programmed process.
With Genmark Mini Max Gencobot 7S/3L Handler.
Model JS-9940 stacked bake unit with 3 ovens.
Inventory#:
42901 View
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CEE -
100:
Precision Spinner.
Fully programmable and user friendly.
Spin Range: 0 to 6,000 rpm.
Acceleration: 0 to 30,000 rpm/sec.
Time: 0 to 999 sec/step with up to 10 steps per program.
Max. Substrate Dia.: 200mm or 6 in. sq.
120V, 60 Hz.
Inventory#:
55054 View
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MTI/S3 -
MULTIFAB:
Photoresist Coating Track System.
Wafer is transferred from elevator to bake and spin coat modules via robotic arm.
All process parameters are programmed on
the system monitor using a light pen.
Inventory#:
51541 View
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MTI -
FLEXIFAB:
Automated Photoresist Coater.
Robot arm transfers wafers between the cassette elevator, the bake module and the spin coat module.
No photoresist pumps.
Stainless steel construction.
Inventory#:
51542 View
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SOLITEC -
OPTITRAC:
Photoresist Developer.
Cassette to cassette photoresist developer. Single spin develop module, 2 bake
cool modules.
PC controller. Small cleanroom footprint.
User friendly software.
Inventory#:
51544 View
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MTI/S3 -
FLEXIFAB:
Photoresist Coating System.
Parts system only. Includes bake, spin, elevator and control units.
Missing some parts. Call for detailed photos.
Inventory#:
51548 View
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TAMARACK -
142:
Vacuum Contact Printer.
For semi-automatic reproduction of photomasks using positive or negative resists.
Inventory#:
51809 View
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THERMO ORIEL -
ACCUDOSE 9000:
Photospeed Tool Measures Batch to Batch Photospeed Variations.
Photoresist testing system. Oriel part 83995 near UV system with fast shutter.
Assures that exposure dosage is in-line with your process window requirements.
No need to sideline your expensive stepper for photoresist testing.
Provides accurate, incremented bulk area exposures across a wafer.
Use it to quantify threshold exposure, spectra variations, find potential resist problems and verify lot to lot consistency.
Inventory#:
53217 View
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GASONICS -
L3510:
Microwave Downstream Plasma Photoresist Removal System.
Wide process window due to the patented large diameter microwave plasma source.
Programmable heating and process controls contribute to the systems unparalled process flexibility.
Wafer Capabilities: 75 to 200 mm.
High throughput, excellent uniformity. Reliable endpoint detection.
Inventory#:
53246 View
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CEE -
100:
Precision Spinner.
Fully programmable and user friendly.
Spin Range: 0 to 6,000 rpm.
Acceleration: 0 to 30,000 rpm/sec.
Time: 0 to 999 sec/step with up to 10 steps per program.
Max. Substate Dia.: 200 mm or 6 in. sq.
120V, 60 Hz.
Inventory#:
54813 View
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EMITECH -
K650X:
Large Sample Sputter Coater.
Triple target sputtering (3 x 80 mm dia.).
No gold targets with system. LCD display of parameters.
Low energy cool system.
Rotating specimen stage: 155 mm dia.
Includes vacuum pump.
Inventory#:
54982 View
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FUSION -
150PC:
Photoresist Photostabilization System.
Fusions rapid, one-step UV/Bake process replaces a standard resist hard bake and allows for higher process margins and increased process consistency.
Cassette to cassette handling of wafers up to 150 mm.
208V, 3 Ph, 60 Hz, 21A.
Inventory#:
53613 View
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HEADWAY RESEARCH/TERRA UNIVERSAL -
PWM32-PS-R790/7018-03-12285-080700:
Stainless Steel Hepa Filtered Hood with Two Photoresist Spinners.
Terra Universal stainless steel hood with overhead Hepa filter, exhaust vents in back of tabletop.
Outside Dimensions: 72-1/2 in. L x 32 in. W x 88 in. H.
Static neutralizing air guns. Two Headway PWM32-PS-R790 spinners.
Up to 10,000 rpm. 7.9 in. ID bowl on spinners for up to 5 in. dia. or diagonal substrates. 120V, 60 Hz, 24A.
Inventory#:
55276 View
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EMITECH -
K550X:
Sputter Coater.
LCD display of parameters.
Single cathode system 60 mm dia.
Specimen Stage: 60 mm dia.
No target with system.
Includes vacuum pump.
Inventory#:
54983 View
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DNS -
SSW-629-B:
Wafer Brush Scrubber with Sonic Cleaning Option.
Cassette to cassette operation. Dual track system.
While low-pressure DI water is sprayed the rotating brush scrubber head is fed across the wafer.
Includes optional D-sonic scrubbing for even higher quality cleaning.
Mfg.: Aug. 1995
Inventory#:
53908 View
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GASONICS -
AURA 1000:
Single Wafer Downstream Microwave Photoresist Stripper.
Downstream microwave asher for high volume wafer fabrication.
Cassette to cassette operation.
Downstream processing helps eliminate wafer radiation damage.
Front and backside access.
Purge gas, 02 and N2 inputs.
Process wafers up to 150 mm.
Includes vacuum pump.
Inventory#:
54001 View
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GASONICS -
AURA 1000:
Single Wafer Downstream Microwave Photoresist Stripper.
Downstream microwave asher for high volume wafer fabrication.
Cassette to cassette operation.
Downstream processing helps eliminate wafer radiation damage.
Front and backside access.
Purge gas, 02 and N2 inputs.
Process wafers up to 150 mm.
Includes vacuum pump.
Inventory#:
54007 View
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GASONICS -
AURA 1000:
Single Wafer Downstream Microwave Photoresist Stripper.
Downstream microwave asher for high volume wafer fabrication.
Cassette to cassette operation.
Downstream processing helps eliminate wafer radiation damage.
Front and backside access.
Purge gas, 02 and N2 inputs.
Process wafers up to 150 mm.
Includes vacuum pump.
Inventory#:
54044 View
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HEADWAY RESEARCH -
PM80:
Bench with Dual Headway Spinners for Substrate Cleaning.
Spinners for substrate cleaning.
Footswitch controlled. Handles up to 6.5 in. dia. substrate.
Variable Speed: Switch under unit allows selection of speed from 500 to 5000 rpm.
120V, 60 Hz.
Inventory#:
55428 View
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All items are covered by our 30-Day Right of Return and 3-Month Warranty
unless otherwise stated. For full details of this policy,
click here!
Note: All
manufacturers names and models are used for illustrative purposes only.
Any trademarks, tradenames or copyrights remain solely the property of
the manufacturer. Unless otherwise stated, all items are used, and
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are copyright 2001-2010 Bid-Service LLC/Sci-Quip and may not be used for
any purpose without prior written permission
CEE -
100:
Precision Spinner.
Fully programmable and user friendly.
Spin Range: 0 to 6,000 rpm.
Acceleration: 0 to 30,000 rpm/sec.
Time: 0 to 999 sec/step with up to 10 steps per program.
Max. Substrate Dia.: 200mm or 6 in. sq.
120V, 60 Hz.
Inventory#:
55054 
