Used and Refurbished Semiconductor Wafer Wedge Bonders
Browse/Search by Keyword(s): wedge
SHINKAWA
SWB-FA-US-30
-
$750 AS IS
SHINKAWA -
SWB-FA-US-30:
Automatic Wire Bonder.
Aluminum wedge wire bonder for low to high lead-count devices with different configuration.
Wedge stroke: Capable of clearing the protuberance 7.5mm high
at maximum from the device surface.
Overall bonding accuracy of +/- 10 micrometers realized by the upgrading
of both the pattern recognition and mechanical accuracy.
Bonding Method: Ultrasonic (pull-cut) wedge bonding.
Pattern recognition time: within 0.25 sec. (2-point alignment).
Recognition range: XY: + 0.23 mm. q: +5 deg. Recognition accuracy: 3.7 mm.
Bonding area: X: 20 mm, Y: 20 mm.
Sold As Is.
Inventory#:
25630 View
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K&S -
8060:
Automatic Wedge Bonder.
Bonding speed of up to 5.5 wires per sec.
Bonds with gold, aluminum and copper wire so you can select the best solution for your process.
System will require K&S calibration, set up and site license at customers expense!
Inventory#:
46216 View
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K&S -
4123:
Manual Wedge Bonder.
Raised work area, no heated work holder.
Aluminum or gold wire wedge bonder.
Wire Diameter: 0.5 to 3.0 mil for gold. 1.0 to 3.0 for aluminum.
115V, 60 Hz.
Inventory#:
49271 View
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MECH EL -
907:
Manual Wedge Bonder.
UTHE dual channel ultrasonic power supply.
Heated transducer.
Wire capability: .5 to 3 mil, requires minor changes for heavy wire.
6:1 micromanipulator.
No work holder or stage.
115V, 60 Hz, 3A
Inventory#:
49269 View
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MECH EL -
907:
Wedge Bonder.
For use with gold or aluminum wire from .5 mil to 3 mil. No work holder.
Stereozoom Microscope with high intensity lighting.
30 degree wire feed with 2 in. spool.
Heated transducer.
Damped Manual Z-Arm with Z-Rotor. Stitch button.
115V, 60 Hz.
Inventory#:
40279 View
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K&S -
4123:
Universal Wedge Bonder.
An aluminum or gold wire bonder versatile enough to bond simple ICs
and discrete devices or complex hybrids with height variations up to 200 mils.
With spotlight target option.
Wire Diameter Range: Gold 0.5 to 3.0 mil., Aluminum 1.0 to 3.0 mil. 120V, 60 Hz.
No Work Holder.
Inventory#:
44064 View
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MECH EL -
907:
Manual Wedge Bonder.
For use with gold or aluminum wire from .5 mil to 3 mil. Includes optional heated work holder.
Bausch & Lomb stereozoom microscope with illuminator.
115V, 60 Hz, 3A.
Inventory#:
50307 View
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MECH EL -
907T:
Manual Wedge Bonder.
For use with gold or aluminum wire from .5 mil to 3 mil.
Includes heated work holder.
Stereozoom microscope.
X-Y control over 1 in. x 1 in. area.
110V, 60 Hz, 3A.
Inventory#:
50608 View
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MECH EL -
907:
Manual Wedge Bonder.
Ultrasonic wedge bonder.
Wire capability: .5 to 3 mil.
Damped manual Z arm.
Stereozoom microscope.
No work holder at this price.
115V, 60 Hz.
Inventory#:
51274 View
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MECH EL -
907:
Manual Ultrasonic Wedge Bonder.
Manual wire bonder.
Wire capability: .5 to 3 mil.
Manual Z arm.
No work holder at this price.
115V, 60 Hz.
Inventory#:
51275 View
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MECH EL -
907:
Wedge Bonder.
For use with gold or aluminum wire from .5 mil to 3 mil.
With optional heated work holder and digital controller.
Stereozoom Microscope with high intensity lighting.
30 degree wire feed with 2 in. spool.
Heated transducer.
Damped Manual Z-Arm with Z-Rotor.
Stitch button. 115V, 60 Hz.
Inventory#:
39112 View
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K&S -
4123:
Universal Wedge Bonder.
An aluminum or gold wire bonder versatile enough to bond simple ICs
and discrete devices or complex hybrids with height variations up to 200 mils.
Wire Diameter Range: Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60Hz.
NO WORK HOLDER.
Inventory#:
52620 View
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K&S -
4129:
Deep Access Manual Wedge Bonder with Heated Work Holder.
Microprocessor controlled bonding parameters. 500 mil access.
Programmable tail length and tear travel.
Wire Size: 0.7 to 2.0 mil.
Heated work holder.
Inventory#:
55384 View
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K&S -
4123:
Universal Wedge Bonder.
An aluminum or gold wire bonder versatile enough to bond simple
ICs and discrete devices or complex hybrids with height variations up to 200 mils.
Wire Diameter Range
Gold: 0.5 to 3.0 mil.
Aluminum: 1.0 to 3.0 mil.
120V, 60 Hz.
NO WORK HOLDER
Inventory#:
54076 View
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PALOMAR -
2470-V:
Automatic Deep Access Large Area Wedge Bonder.
On screen menus prompt operators through setup and programming.
Precise loop and wire length control.
Dual mode ultrasonics.
Heated X-Y Robotic Stage: 4 in. x 4 in.
Automatic wire feeder. Program storage.
118V, 1 Ph, 50/60 Hz, 12A, CE.
Inventory#:
53307 View
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All items are covered by our 30-Day Right of Return and 3-Month Warranty
unless otherwise stated. For full details of this policy,
click here!
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K&S -
4129:
Deep Access Manual Wedge Bonder with Heated Work Holder.
Microprocessor controlled bonding parameters. 500 mil access.
Programmable tail length and tear travel.
Wire Size: 0.7 to 2.0 mil.
Heated work holder.
Inventory#:
55384 
