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APPLIED MATERIALS  CENTURA 300MM Metal CVD Chemical Vapor Deposition Centura Dual Polygen Two Polygen 300 PH3 Doped and Two DSCXZ 300 Tungsten Silicide. CONFIGURATION: Mainframe: 300mm AMAT Centura HT Polycide. 3 Load Ports. OHT WIP Delivery. E84 PIO Sensor and Cables: Upper E84 Sensors and Cablcs. E99 Carrier ID: HERMOS with RF. Ch A: Polygen 300 - PH3 Doped Main Dep Manifold: N2 - Pump Purge. N2 - 20.0 SLM. H2 - 10.0 SLM. 1 percent PH3 in 99 percent H2 - 100 sccm. SIH4 - 500 sccm. Clean Manifold: NF3 - 1.0 SLM. AR - 6 SLM. N2 - Pump Purge. Bottom Purge Manifold: N2 - 20 SLM. N2 - Heater Purge. Ch B: Polygen 300 - PH3 Doped. Main Dep Manifold: N2 - Pump Purge. N2 - 20.0 SLM. H2 - 10.0 SLM. 1 percent PH3 in 99 percent H2 - 100 sccm. SIH4 - 500 sccm. Clean Manifold: NF3 - 1.0 SLM. AR - 6 SLM. N2 - Pump Purge. Bottom Purge Manifold: N2 - 20 SLM. N2 - Heater Purge. Ch C: DCSXZ 300 - Tungsten Silicide. First Dep. Manifold: AR - Pump Purge. AR - 3.0 SLM. SIH4 - 2.0 SLM. DCS - 1.0 SLM. Second Dep Manifold: WF6 - 20 sccm. AR - 3.0 SLM. AR - Pump Purge. Clean Manifold: NF3 - 1.0 SLM. AR - 3.0 SLM. AR -Pump Purge. Bottom Purge Manifold: AR - 3.0 SLM. Heater Purge Manifold: N2 Heater Purge. Ch D: DCSXZ 300 - Tungsten Silicide. First Dep Manifold: AR - Pump Purge. AR - 3.0 SLM. SIH4 - 2.0 SLM. DCS - 1.0 SLM. Second Dep Manifold: WF6 - 20 sccm. AR - 3.0 SLM. AR - Pump Purge. Clean Manifold: NF3 - 1.0 SLM. AR - 3.0 SLM. AR - Pump Purge. Bottom Purge Manifold: AR - 3.0 SLM. Heater Purge Manifold: N2 Heater Purge. Upgrades: Polygen 300 (Ch A and B) Bottom Purge upgraded to H2. PRICE: BEST OFFER!. $BEST OFFER! View Details and Photo
APPLIED MATERIALS  EXCITE High Speed Particle Detection System for Bare Wafer or Patterned Wafer Inspection. Inspects device wafers after processing is completed or inspects blanket films. Blanket films can be inspected at over 60 wafers per hour and patterned wafers at over 45 wph. .1 micrometer particle detection on unpatterned silicon. Windows NT operating system. Currently configured for 200mm wafers but can be configured for 300mm. Date of Mfg. 2003. $49,000 View Details and Photo
APPLIED MATERIALS  HDP Etch Chamber. $79,000 View Details and Photo

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