|

Phone: 732-863-9500
FAX: 732-863-1255
Email:
Sales |
|
Have equipment
sitting idle?
We're always
in the market for quality high-tech equipment!
Click Here! |
| |
|
Mfg by First Letter: A -
B - C -
D - E -
F - G -
H - I -
J - K -
L - M -
N - O -
P - Q -
R - S -
T - U -
V - W -
X - Y -
Z -
0-9
|
|
A few of the
manufacturers in stock:
Advanced Energy,
Applied
Materials,
Balzers, Bausch
& Lomb, Blue-M,
CTI,
Dage,
Disco,
Edwards,
ENI,
ESI,
Fluke,
HP,
Inficon,
Instron,
K&S,
Keithley,
Kepco,
Lambda,
Leica,
Leitz,
Leybold,
MRC,
Nanometrics,
Neslab,
Nikon,
Olympus,
Perkin Elmer,
Prometrix,
Rucker & Kolls,
SemiGas,
Semitool,
Signatone,
Sorensen,
SSEC,
STI,
Strasbaugh,
SVG,
Tegal,
Tektronix,
Temescal,
Tencor,
Varian,
Veeco,
Verteq,
West Bond,
Wild,
Yield,
Zeiss |
Inventory in Stock, Manufacturer D
No Dage, no Disco
| Manufacturer/Model |
Description |
Info
|
|
|
DAECO ELECTRONICS
LASER BURN-IN TESTER |
5 drawer system.
Each drawer contains a programmable DC power supply, carousel temp. readout, elapsed time display.
Inside the drawer is a carousel for testing
20 lasers. Water cooled.
Job #P010-3911-1..
$10,000 |
View Details and Photo
|
|
DAINI SEIKOSHA
SFT/156 |
Fluorescent X-Ray Measurement System.
X-Y Stage: 3 in. x 3 in.
Travel Z.
Adjustment: 1.3 in. Min.
Measurement area: .005 in..
$450 AS IS |
View Details and Photo
|
|
DATA RAY
BEAM MAP |
Laser Beam Profiling System.
Evaluate precision laser and fiber optic assemblies.
Real Time M2, profiling, divergence, focusing and alignment.
Head Model: BMH4XY500/IGA.
InGaAs detector head..
$3,950 |
View Details and Photo
|
|
DEK
248CE |
Screen Printer.
Semi-automatic surface mount screen printer with align 4 vision system.
PC controller.
Frame Size: 20 in. x 20 in. internal.
Print stroke: 17.7 in. max. Print speed: 0.4 to 2.95 in/sec.
Menu storageof 35 separate programs.
110V, 50/60 Hz, CE..
$12,000 |
View Details and Photo
|
|
DELTA DESIGN
2850C |
Temperature Chamber. Analog control.
Temp. Range: -73 to 315 deg. C.
Inside Chamber Dimensions: 7 in. H x 16 in. W x 7 in. D.
120V, 60Hz, 20A. REQUIRES CO2 FOR COOLING..
$1,250 |
View Details and Photo
|
|
DELTA DESIGN
4145CD |
Board Hot/Cold Burn-In Chamber.
Requires LN2 or CO2 for cooling.
Temp. Range: -73 to +315 deg C.
Digital temperature readout.
Inside Dimensions: 15-1/2 in. L x 13 in. W x 36 in. H.
240V, 1 Ph, 60 Hz..
$1,950 |
View Details and Photo
|
|
DELTA DESIGN
4145CD |
Board Hot/Cold Burn-In Chamber.
Requires LN2 or CO2 for cooling.
Temp. Range: -73 to +315 deg C.
Digital temperature readout.
Inside Dimensions: 15-1/2 in. L x 13 in. W x 36 in. H.
240V, 1 Ph, 60 Hz..
$1,950 |
View Details and Photo
|
|
DELTA SONICS
RSX1012-4G |
Ultrasonic Cleaning System.
System Configuration:
Heated Ultrasonic Tank: 12 in. L x 10 in. W x 8 in. H.
Spray Rinse: 12 in. L x x 12 in. W x 10 in. H.
Heated Ultrasonic Cascade Tank: 12 in. L x 10 in. W x 12 in. H.
Dryer Tank: 12 in. L x 9 in. W x 12 in. H.
480V, 3 Ph, 60 Hz, 25A..
$15,000 |
View Details and Photo
|
|
DENTON VACUUM
DEG-2 MINIGUN |
Electron Gun Power Supply.
4 to 5 kW source.
No cables..
$1,950 |
View Details and Photo
|
|
DENTON VACUUM
PE-250 UN2 |
Tabletop Etcher/Asher.
Designed to handle a broad range of etching gases and processes.
Manual matching network with 250W built-in
RF power supply.
Process Chamber: 7-1/2 in. dia. x 8 in. D.
Includes vacuum pump..
$9,500 |
View Details and Photo
|
|
DESIGN COMPONENTS
DC-66 |
Motorized Stage.
10 in. x 10 in.
No controller, stage only..
$1,250 |
View Details and Photo
|
|
DESPATCH
925-1-1-D-0-120 |
Benchtop Temperature Chamber.
Requires CO2 for cooling 900 psi max.
Precision high low temp. simulation with programmable profiling control.
Temp. Range: -73 to +274 deg C.
Inside Dimensions: 14-1/2 in. L x 11 in. W x 8-1/2 in. H.
115V, 60 Hz, 19.5A..
$2,150 |
View Details and Photo
|
|
DESPATCH
925-1-1-D-0-120 |
Benchtop Temperature Chamber.
Requires CO2 for cooling 900 psi max.
Precision high low temp. simulation with programmable profiling control.
Temp. Range: -73 to +274 deg C.
Inside Dimensions: 14-1/2 in. L x 11 in. W x 8-1/2 in. H.
115V, 60 Hz, 19.5A. .
$2,150 |
View Details and Photo
|
|
DESPATCH
925-1-1-D-0-120 |
Benchtop Temperature Chamber.
Requires CO2 for cooling.
900 psi max. Precision high low temp. simulation with programmable profiling control.
Temp. Range: -73 to +274 deg C.
Inside Dimensions: 14-1/2 in. L x 11 in. W x 8 1/2 in. H.
115V, 60 Hz, 19.5A..
$2,150 |
View Details and Photo
|
|
DESPATCH
925E-1-2-0-120 |
Benchtop Temperature Chamber.
Requires CO2 for cooling.
Precision high low temp. simulation with programmable profiling control.
Temp. Range: -73 to +274 deg C.
Inside Dimensions: 14-1/2 in. L x 11 in. W x 8 1/2 in. H.
115V, 60 Hz, 19.5A..
$2,150 |
View Details and Photo
|
|
DESPATCH
925E-1-3-0-120 |
Benchtop Temperature Chamber.
Requires CO2 for cooling.
Precision high low temp. simulation with programmable profiling control.
Temp. Range: -73 to +274 deg C.
Inside Dimensions: 14-1/2 in. L x 11 in. W x 8-1/2 in. H.
115V, 60 Hz, 19.5A..
$2,150 |
View Details and Photo
|
|
DESPATCH
LFD1-42-3 |
Class A Oven.
Specially designed for applications with flammable solvents or high moisture content removal.
Digital programmable controller.
Max. Temp.: 371 deg C.
Inside Dimensions: 18 in. L x 18 in. W x 20 in. H.
208V, 1 Ph, 60 Hz, 23.5A..
$4,250 |
View Details and Photo
|
|
DESPATCH
LFD1-42-3 |
Class A Series Oven.
Digital programmable controller.
Max. Temp.: 343 deg C.
Inside Dimensions: 18 in. L x 18 in. W x 20 in. H.
Explosion relief on top of oven.
208V, 1 Ph, 60 Hz, 32.5A..
$4,250 |
View Details and Photo
|
|
DIANO
Match Scan II |
Color Spectrophotometer.
Color measuring instrument.
Sample measurement continuously adjustable from 20mm to 5mm. Wavelength: 380-700nm.
Bandwidth: 10nm.
Measurement Time: 16 point data: 9 sec.
161 point data: 42 sec.
120/240 V, 50/60 Hz..
$2,450 AS IS |
View Details and Photo
|
|
DIONEX
2000 |
Low Temperature Asher.
Three process gas inputs.
10 in. dia. x 20 in. D quartz.
PM 119 13.56 MHz 500W RF Generator.
Corrosive series vacuum pump.
Only one process control..
$17,500 |
View Details and Photo
|
|
DIVERSIFIED TECHNOLOGIES
HPM 2.5-150110397 |
High Power Modulator..
$1,950 |
View Details and Photo
|
|
DNS
SSW-629-B |
Wafer Brush Scrubber with Sonic Cleaning Option.
Cassette to cassette operation. Dual track system.
While low-pressure DI water is sprayed the rotating brush scrubber head is fed across the wafer.
Includes optional D-sonic scrubbing for even higher quality cleaning.
Mfg.: Aug. 1995.
$19,500 |
View Details and Photo
|
|
DRYTEK
2600422-REP |
Dual Output 13.56 MHz RF Generator.
Output Frequency: 13.56 MHz.
Output Power: 1000W on each of the 2 outputs.
208V, 3 Ph, 60 Hz..
$2,950 |
View Details and Photo
|
|
DUBILIER
ION SOURCE |
Ion Source..
$1,250 |
View Details and Photo
|
|
DUPONT
28C MK2 |
Film Processor.
Date of Mfg.: 1992..
$3,500 |
View Details and Photo
|
|
DYNATEX
DX-II |
Wafer Breaker.
Breaks either diamond or saw scribed wafers up to 2 in. dia.
120V, 60 Hz. .
$1,950 |
View Details and Photo
|
|
DYNATEX
DX-III |
Scriber Breaker.
Fully programmable for all scribing and breaking parameters.
Wafers up to 39 mils thick can be processed, as well as die 5 mils sq.
Fully programmable for edge, skip and continuous wafer scribing.
Scribe angle is programmable in 0.1 degree increments.
Can be used for substrates up to 4 in. dia.
120V, 60 Hz, 5A..
$29,500 |
View Details and Photo
|
|
DYNATEX
GST-150 |
150mm Scriber Breaker. Capable of completely and automatically scribing and breaking many substrate materials. Alternative method to saw dicing for up to 6in. silicon and GaAs applications. Fully programmable for all scribing and breaking parameters.
Stored process eliminates operator adjustments when changing between wafer types.
Max. wafer size 150mm, wafer thickness 40 to 1725 micrometers. Minimum Die Size: 200 micrometers sq. 100/240V,1 Ph, 50/60 Hz, 10/5A,CE..
$85,000 |
View Details and Photo
|
|
DYNATEX
GST-150 |
150mm Fully Programmable Scriber Breaker.
Designed to increase yield and provide superior processing speeds.
Windows® operating environment provides a fast user friendly interface.
Zero kerf loss allows higher die density on wafer.
Fully programmable for all scribing and breaking parameters including TrueAngleTM diamond
tool positioning. Currently configured for 6 in. dia. tape rings and up to 4 in. dia. wafers.
Can be retooled to do up to 150mm wafers.
100-240V,1 Ph,50/60 Hz,10/5A, CE. .
$59,000 |
View Details and Photo
|
|
DYNAVAC
8542 |
Ion Source Controller..
$1,250 |
View Details and Photo
|
|