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Disco
Inventory in Stock
| Manufacturer/Model |
Description |
Info
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DISCO
DAC-2SP/86 |
Automated Dicing Saw.
Max. Substrate Size: 150 mm.
Range of Indexing: 0.0001 to 99.9999 mm.
Minimum Step Indexing: 0.00025 mm.
Spindle Rotation: 3000 to 40,000 rpm.
Older dicing saw but in good condition..
$17,500 |
View Details and Photo
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DISCO
DAD-2H/6TM |
Dicing Saw.
Microprocessor controller.
Dicing of wafers up to 6 in.
Manual theta axis rotation.
Y-Axis Index Accuracy: 0.003 mm/152.4 mm.
Split image alignment camera.
200V, 3 Ph, 50/60 Hz..
$15,000 |
View Details and Photo
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DISCO
DAD521 |
Automatic Dicing Saw.
Designed to cut brittle materials such as silicon wafers, glasses and ceramics.
Can accommodate wafers from 3 in. to 6 in.
Cutting Range: Circle: 0.01 to 160.00 mm. Square: 0.01 to 220.00 mm.
Vacuum Chuck: 6-1/4 in. dia.
4-Axis Index Setting Range: 0.0001 to 160.0000 mm, Min. Step: 0.2 micrometers.
Air bearing spindle programmable 3,000 to 40,000 rpm, water cooling.
200V, 3 Ph, 50/60 Hz..
$37,500 |
View Details and Photo
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