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ESI  4420 Laser Micromachining System. Solves problems associated with smaller vias, finer lines and new materials, allowing manufacturers to achieve new levels of micromachining accuracy and control. Step and Repeat Parts Handling Travel: 152.4 mm x 152.4 mm. Laser Beam Positioning Field Size: 76.2 mm x 76.2 mm. Accuracy: +/-5 micrometers. Resolution: 2.5 micrometers. Q-Switched Nd:Yag Laser, 266 nm with peak power 3.3 kW. 208V, 3 Ph, 60 Hz. Date of Mfg.: 4/2000. $45,000 View Details and Photo
ESI  9250B Laser Semiconductor Processing System. Cassette to cassette wafer handling for wafers up to 200mm. Pattern recognition. Submicron positioning accuracy. Stable precise energy control. System Manufactured in 1996.. $39,000 View Details and Photo

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