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K&S Inventory in Stock:

Manufacturer/Model Description

Info
K&S  1488 Plus Automatic Gold Ball Bonder. Computer controlled system Graphic displays and interactive display. CALL FOR DETAILS.. $19,000 View Details and Photo
K&S  4123 Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. Wire Diameter Range: Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60Hz. NO WORK HOLDER. $7,500 View Details and Photo
K&S  4123 Manual Wedge Bonder. Raised work area, no heated work holder. Aluminum or gold wire wedge bonder. Wire Diameter: 0.5 to 3.0 mil for gold. 1.0 to 3.0 for aluminum. 115V, 60 Hz.. $7,500 View Details and Photo
K&S  4123 Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. With spotlight target option. Wire Diameter Range: Gold 0.5 to 3.0 mil., Aluminum 1.0 to 3.0 mil. 120V, 60 Hz. No Work Holder.. $7,500 View Details and Photo
K&S  4123 Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. Wire Diameter Range: Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60Hz. NO WORK HOLDER.. $7,500 View Details and Photo
K&S  4123 Universal Manual Wedge Bonder with Heated Work Holder. Aluminum or gold wire wedge bonder. Wire Diameter Range: Gold 0.5 to 3.0 mil., Aluminum 1.0 to 3.0 mil. Front panel electronic setting of bonding parameters.. $8,500 View Details and Photo
K&S  4123 Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. Wire Diameter Range Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60 Hz. NO WORK HOLDER. $7,500 View Details and Photo
K&S  4123/4124 Maintenance Kit. Kit for aligning transducer.. $450 View Details and Photo
K&S  4124 Gold Ball Bonder with Heated Work Stage. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $8,500 View Details and Photo
K&S  4124 Gold Ball Bonder with Heated Work Holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. Includes heated work holder. 120V, 60 Hz.. $8,500 View Details and Photo
K&S  4124 Gold Ball Bonder with Heated Work Stage. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz. . $8,500 View Details and Photo
K&S  4124 Gold Ball Bonder with Heated Work Stage. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $9,250 View Details and Photo
K&S  4124 Gold Wire Ball Bonder with Negative EFO and Heated Work Holder. For hybrid, microwave, opto-devices or IC applications. Accurate loop and force conrol. Electronically controlled tail length. Wire Sizes: 0.7 to 3.0 mil. 120V, 60 Hz.. $8,500 View Details and Photo
K&S  4124 Gold Ball Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $7,500 View Details and Photo
K&S  4124 Gold Ball Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $7,500 View Details and Photo
K&S  4124 Gold Ball Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $7,500 View Details and Photo
K&S  4124 Gold Ball Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $7,500 View Details and Photo
K&S  4124 Gold Ball Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $7,500 View Details and Photo
K&S  4124 Gold Ball Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $7,500 View Details and Photo
K&S  4522 Ball Bonder with Ball Bumping and Deep Access Capability and Motorized Y Stage Option. Semi-automatic and manual operation modes. Consistent ball size via negative electronic flame-off. Consistent tail length with fine adjustment control. Individual bond parameter control. Motorized stage controller. Right hand mouse with Z switch. Wire diameter: 0.7 to 3 mil. 115V, 50/60 Hz, 4A, CE. Includes heated work holder.. $14,950 View Details and Photo
K&S  4525 Tab Bonder. StereoZoom microscope. Front panel control of bonding parameters. No work holder. 115V, 60 Hz, 4A, CE.. $9,500 View Details and Photo
K&S  5408-15 EM Die Attach System. Multi-chip module production selectable leadframe unstacker and magazine loader die attach system is optimized for small to large die picked from wafer or waffle packs. Robust vision processing system.. $1,500 AS IS View Details and Photo
K&S  7100 AD Precision Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A. . $35,000 View Details and Photo
K&S  7100 AD Precision Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A. . $35,000 View Details and Photo
K&S  7100 AD Precision Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A. . $35,000 View Details and Photo
K&S  7100 AD Precision Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A. . $35,000 View Details and Photo
K&S  7100 AD Precision Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.. $35,000 View Details and Photo
K&S  7100 AD Precision Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.. $35,000 View Details and Photo
K&S  7100 ADHMAL Precision Dicing Saw with Autoloader. High accuracy and process control package. 4 in. dia. spindle for cutting hard materials. Max. Speed: 30,000 rpm. 8 in. x 8 in. vacuum chuck. Cutting Area: 200mm x 200mm. Thickness to 12mm. 50mm Z Travel. Auto-height, mechanical contact. Mfg.: April 2002. 200/240V., 1 Ph., 50/60 Hz., 15A.. $49,000 View Details and Photo
K&S  7100AD HM Precision Dicing Saw Suitable for Hard Materials. Windows based operating system. 4 in. spindle programmable to 30,000 rpm. Blade Size: 4 in. to 5 in. 8 in. dia. pourous vacuum chuck. Indexing Axis Resolution: 0.2 micrometers. Vision system for street alignment. Mfg.: 2001. 220/240V, 1 Ph, 50/60 Hz, 15A.. $49,000 View Details and Photo
K&S  775 Wafer Dicing Saw. Older saw, but being sold tested and in good working condition. 2 in. dia. spindle. Cutting Range: 0 to 6 in. Stroke: 10.5 in.. $9,500 View Details and Photo
K&S  8028 Automatic Ball Bonder. The standard in speed and fine pitch. 43 micron bonded ball production process. Fully programmable material handling system. Graphical user interface. Date of Mfg.: 2000.. $29,000 View Details and Photo
K&S  8028 PPS Automatic Ball Bonder with Precision Plus Speed Option. Fully programmable material handling system. 43 micron bonded ball production process. Lightweight XY table design delivers ultra high speed while maintaining 0.1 micrometers resolution. Graphical user interface. Date of Mfg.: 2001.. $29,000 View Details and Photo
K&S  8028 PPS Automatic Ball Bonder with Precision Plus Speed Option. Fully programmable material handling system. 43 micron bonded ball production process. Lightweight XY table design delivers ultra high speed while maintaining 0.1 micrometers resolution. Graphical user interface. Date of Mfg.: 2000.. $29,000 View Details and Photo
K&S  8060 Automatic Wedge Bonder. Bonding speed of up to 5.5 wires per sec. Bonds with gold, aluminum and copper wire so you can select the best solution for your process. System will require K&S calibration, set up and site license at customers expense!. $29,000 View Details and Photo
K&S  960-6 Wafer Mounting Station. Programmable heated vacuum stage. Built in tape cutter. Accepts film frames. Accepts up to 6 in. dia. wafers with the use of the correct chuck (currently has a chuck for 2 in. x 2 in. squares).. $4,250 View Details and Photo
K&S  960-6 Wafer Mounting Station. Programmable heated vacuum stage currently configured for 4 in. dia. wafers. Compatible with standard or interleaved tape. Built-in cutter. 115V, 50/60 Hz, CE.. $4,250 View Details and Photo
K&S  960-8 Wafer Mounting Station for 8 in. Wafers. Compatible with standard or interleaved tape. Vacuum stage wafer hold down. Programmable heated vacuum stage. Built-in tape cutter. Non-contact platen option. 115V, 60 Hz, 5A, CE.. $4,250 View Details and Photo
K&S  972 Wafer Cleaning Station. For submicron cleaning of photomasks, wafers and a variety of diced materials. Oscillating, high pressure, de-ionized water spray. 0.2 micrometers filtration. Reionizer for static removal. Rapid spin dry with nitrogen blow off and heating lamp. Chuck with 6 in. pourous vacuum surface. 115V, 60 Hz, 5A.. $11,000 View Details and Photo
K&S  973 High Pressure Microwash Substrate Cleaning System. For sawed/scribed wafers or photomask cleaning. Utilizes an oscillating high pressure deionized water jet spray of up to 2000 psi with 0.2 micron filtration. Handles wafers up to 8 in. dia. depending on type of chuck installed. Touch screen operation. CO2 re-ionizer for elimination of static charge. Nitrogen dry. Infrared heat lamp. 115V, 50/60 Hz, 6A.. $9,500 View Details and Photo
K&S  973 High Pressure Microwash Substrate Cleaning System. For sawed/scribed wafers or photomask cleaning. Utilizes an oscillating high pressure deionized water jet spray of up to 2000 psi with 0.2 micron filtration. Handles wafers up to 8 in. dia. depending on type of chuck installed. Touch screen operation. CO2 re-ionizer for elimination of static charge. Nitrogen dry. Infrared heat lamp. 115V, 50/60 Hz, 6A.. $9,500 View Details and Photo
K&S  973 High Pressure Microwash Substrate Cleaning System. For sawed/scribed wafers or photomask cleaning. Utilizes an oscillating high pressure deionized water jet spray of up to 2000 psi with 0.2 micron filtration. Handles wafers up to 8 in. dia. depending on type of chuck installed. Touch screen operation. CO2 re-ionizer for elimination of static charge. Nitrogen dry. Infrared heat lamp. 115V, 50/60 Hz, 6A.. $9,500 View Details and Photo
K&S  973 High Pressure Microwash Substrate Cleaning System. For sawed/scribed wafers or photomask cleaning. Utilizes an oscillating high pressure deionized water jet spray of up to 2000 psi with 0.2 micron filtration. Handles wafers up to 8 in. dia. depending on type of chuck installed. Touch screen operation. CO2 re-ionizer for elimination of static charge. Nitrogen dry. Infrared heat lamp. 115V, 50/60 Hz, 6A.. $9,500 View Details and Photo
K&S  982-6 Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6 in. dia. vacuum chuck. Air bearing spindle with 2 in. dia. blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting. . $32,500 View Details and Photo
K&S  982-6 Plus Precision Dicing System. Precision dicing saw for samples up to 6 in. x 6 in. Process parameters are totally programmable through interactive menu-driven screens. 2 in. air bearing spindle with a speed of 4,000 to 40,000 rpm. Currently configured with vacuum chuck for square samples up to 6 in. x 6 in. 208V, 1 Ph, 50/60 Hz. Date of Mfg.: 10/99.. $32,500 View Details and Photo
K&S  982-6 Plus Precision Dicing Saw. Process parameters are totally programmable through interactive menu-driven screens. For wafers up to 6 in. in diameter. 2 in. air bearing spindle with a maximum speed of 40,000 rpm. Date of Mfg.: 2000. 208V, 1 Ph, 50/60 Hz, 15A.. $35,000 View Details and Photo
K&S  984-6 Precision Dicing Saw for Hard Materials. 4 in. dicing technology for superior sawing. Automated process control. For cutting hard materials up to 6 in. dia. Sub-micron accuracy. 4 in. spindle. 208V, 1 Ph, 50/60 Hz, 15A.. $32,950 View Details and Photo
K&S  990 M/C SPINDLE Dicing Saw Spindles. 4 in. spindle for K&S dicing saws. PN 1300-0041-000. 14,000 RPM. D03541 DC brushless spindle. . $2,950 NEW IN BOX View Details and Photo

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Note: All manufacturers names and models are used for illustrative purposes only. Any trademarks, tradenames or copyrights remain solely the property of the manufacturer. Unless otherwise stated, all items are used, and Bid-Service is not a manufacturer authorized representative. All images are copyright 2001, 2002, 2003, 2004, 2005, 2006, 2007 Bid-Service LLC/Sci-Quip and may not be used for any purpose without prior written permission

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