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K&S Inventory in Stock:

Manufacturer/Model Description

Info
K&S  1488 Plus Automatic Gold Ball Bonder. Computer controlled system Graphic displays and interactive display. CALL FOR DETAILS.. $19,000 View Details and Photo
K&S  4123 Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. Wire Diameter Range: Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60Hz. NO WORK HOLDER.. $8,500 View Details and Photo
K&S  4123 Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. With spotlight target option. Wire Diameter Range: Gold 0.5 to 3.0 mil., Aluminum 1.0 to 3.0 mil. 120V, 60 Hz. No Work Holder.. $8,500 View Details and Photo
K&S  4123 Manual Wedge Bonder. Raised work area, no heated work holder. Aluminum or gold wire wedge bonder. Wire Diameter: 0.5 to 3.0 mil for gold. 1.0 to 3.0 for aluminum. 115V, 60 Hz.. $8,500 View Details and Photo
K&S  4123 Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. Wire Diameter Range: Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60Hz. NO WORK HOLDER. $8,500 View Details and Photo
K&S  4123 Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. Wire Diameter Range - Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60 Hz. NO WORK HOLDER.. $8,500 View Details and Photo
K&S  4123 Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. Wire Diameter Range: Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60 Hz. NO WORK HOLDER. $8,500 View Details and Photo
K&S  4123 Universal Manual Wedge Bonder with Heated Work Holder. Aluminum or gold wire wedge bonder. Wire Diameter Range: Gold 0.5 to 3.0 mil., Aluminum 1.0 to 3.0 mil. Front panel electronic setting of bonding parameters.. $9,000 View Details and Photo
K&S  4123/4124 Maintenance Kit. Kit for aligning transducer.. $450 View Details and Photo
K&S  4124 Gold Ball Bonder with Heated Work Holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. Includes heated work holder. 120V, 60 Hz.. $9,500 View Details and Photo
K&S  4124 Gold Ball Bonder with Heated Work Stage. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $9,500 View Details and Photo
K&S  4124 Gold Ball Bonder with Heated Work Stage. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz. . $9,500 View Details and Photo
K&S  4124 Gold Ball Bonder with Heated Work Stage. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $9,500 View Details and Photo
K&S  4522 Ball Bonder with Ball Bumping and Deep Access Capability and Motorized Y Stage Option. Semi-automatic and manual operation modes. Consistent ball size via negative electronic flame-off. Consistent tail length with fine adjustment control. Individual bond parameter control. Motorized stage controller. Right hand mouse with Z switch. Wire diameter: 0.7 to 3 mil. 115V, 50/60 Hz, 4A, CE. Includes heated work holder.. $14,950 View Details and Photo
K&S  4523 Manual Wedge Bonder with Heated Work Holder. Offers the versatility to bond simple discrete devices up to complex hybrid, microwave devices. Wire Diameter Range: Gold: 0.7 to 3 mil, Aluminum: .8 to 3 mil. StereoZoom microscope. Individual control of loop height and force. Includes optional heated work holder. 115V, 50/60 Hz, 4A, CE.. $13,950 View Details and Photo
K&S  4523 Manual Wedge Bonder with Heated Work Holder. Offers the versatility to bond simple discrete devices up to complex hybrid, microwave devices. Wire Diameter Range: Gold: 0.7 to 3 mil, Aluminum: .8 to 3 mil. StereoZoom microscope. Individual control of loop height and force. Includes optional heated work holder. 115V, 50/60 Hz, 4A, CE.. $13,950 View Details and Photo
K&S  5408-15 EM Die Attach System. Enables multi-chip module production through an exclusive multi-pass system that features a selectable leadframe unstacker and magazine loader for input of leadframes with die already attached. The die attach system is optimized for small, medium and large die picked from either wafer or waffle packs, including high value, yield sensitive die. Robust vision processing enhances system flexibility by performing wafer leadframe, adhesive, and post-bond inspection during the bonding process. Wafer Size: Up to 8 in. in diameter (max.); requires separate clamp ring kits for 5 in., 6 in. or 8 in. wafers. Die Size: 0.150 in. to .600 in. Bonding Accuracy: Die placement (X-Y): plus or minus 2 mils, 3 sigma; Die rotation: plus or minus 1 deg., 3 sigma Dispense Capability: X-Y-Z axis positioning micrometer adjustable, Programmable post-dispense dwell. Dispense duration: 0 to 1 minute Utilities: Electrical: 208-240VAC (plus or minus 5 percent VAC), single phase, 50/60 Hz; Air: 80 psi (min), clean/dry at 4 SCFM. . $29,500 View Details and Photo
K&S  7100AD HM Precision Dicing Saw Suitable for Hard Materials. Windows based operating system. 4 in. spindle programmable to 30,000 rpm. Blade Size: 4 in. to 5 in. 8 in. dia. pourous vacuum chuck. Indexing Axis Resolution: 0.2 micrometers. Vision system for street alignment. Date of Mfg.: 2001. 220/240V, 1 Ph, 50/60 Hz, 15A.. $49,000 View Details and Photo
K&S  775 Wafer Dicing Saw. Older saw, but being sold tested and in good working condition. 2 in. dia. spindle. Cutting Range: 0 to 6 in. Stroke: 10.5 in.. $9,500 View Details and Photo
K&S  8028 Automatic Ball Bonder. The standard in speed and fine pitch. 43 micron bonded ball production process. Fully programmable material handling system. Graphical user interface. Date of Mfg.: 2000.. $39,000 View Details and Photo
K&S  8028 PPS Automatic Ball Bonder with Precision Plus Speed Option. Fully programmable material handling system. 43 micron bonded ball production process. Lightweight XY table design delivers ultra high speed while maintaining 0.1 micrometers resolution. Graphical user interface. Date of Mfg.: 2000.. $39,000 View Details and Photo
K&S  8028 PPS Automatic Ball Bonder with Precision Plus Speed Option. Fully programmable material handling system. 43 micron bonded ball production process. Lightweight XY table design delivers ultra high speed while maintaining 0.1 micrometers resolution. Graphical user interface. Date of Mfg.: 2001.. $39,000 View Details and Photo
K&S  8060 Automatic Wedge Bonder. Bonding speed of up to 5.5 wires per sec. Bonds with gold, aluminum and copper wire so you can select the best solution for your process. System will require K&S calibration, set up and site license at customers expense!. $39,000 View Details and Photo
K&S  960-6 Wafer Mounting Station. Accepts up to 6 in. wafers. Compatible with standard or interleaved tape. Vacuum stage wafer hold down. Built in tape cutter separation system. Heated stage to 60 deg C max. 115V, 50/60 Hz, 3A.. $4,950 View Details and Photo
K&S  960-6 Wafer Mounting Station. Programmable heated vacuum stage. Built in tape cutter. Accepts film frames. Accepts up to 6 in. dia. wafers with the use of the correct chuck (currently has a chuck for 2 in. x 2 in. squares).. $4,250 View Details and Photo
K&S  960-8 Wafer Mounting Station. Mounts wafers to film frames for dicing. Accepts wafers up to 8 in. dia. Programmable heated vacuum stage for void free bonding to tape. Built in tape cutter. 115V, 50/60 Hz, 5A.. $4,950 View Details and Photo
K&S  982-6 Plus Precision Dicing Saw. Process parameters are totally programmable through interactive menu-driven screens. For wafers up to 6 in. in diameter. 2 in. air bearing spindle with a maximum speed of 40,000 rpm. Date of Mfg.: 2000. 208V, 1 Ph, 50/60 Hz, 15A.. $35,000 View Details and Photo
K&S  984-6 Plus Precision Dicing System for Hard & Thick Materials. Larger 4 in. spindle designed to utilize blades up to 5 in. dia. Process parameters are totally programmable through interactive menu-driven screens. For substrates up to 6 in. dia. 208V, 1 Ph, 50/60 Hz, 15A.. $35,000 View Details and Photo
K&S  990 M/C SPINDLE Dicing Saw Spindles. 4 in. spindle for K&S dicing saws. PN 1300-0041-000. 14,000 RPM. D03541 DC brushless spindle. . $2,950 NEW IN BOX View Details and Photo

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Note: All manufacturers names and models are used for illustrative purposes only. Any trademarks, tradenames or copyrights remain solely the property of the manufacturer. Unless otherwise stated, all items are used, and Bid-Service is not a manufacturer authorized representative. All images are copyright 2001, 2002, 2003, 2004, 2005, 2006, 2007 Bid-Service LLC/Sci-Quip and may not be used for any purpose without prior written permission