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A few of the manufacturers in stock: Advanced Energy, AMI-Presco, Applied Materials, Anritsu, Balzers, Bausch & Lomb, Blue-M, CTI, Dage, Disco, Ebara, Edwards, ENI, ESI, Fluke, Hitachi, HP, Inficon, Instron, K&S, Keithley, Kepco, Lambda, Lauda, Leica, Leitz, Leybold, Micromanipulator, MKS, MRC, Nanometrics, Neslab, Nikon, Olympus, Perkin Elmer, Prometrix, Reichert, Rucker & Kolls, SemiGas, Semitool, Signatone, Sorensen, SSEC, STI, Strasbaugh, SVG, Tegal, Tektronix, Temescal, Tencor, Varian, Veeco, Verteq, West Bond, Wild, Yield, Zeiss

Inventory in Stock, Manufacturer K
(No K&S, no Kepco, no Keithley)

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Manufacturer/Model Description

Info
K&S   4124 Gold Ball Bonder. Includes heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.. $8,500 View Details and Photo
KALIX  SEALER More information to come, contact us for details.. $- View Details and Photo
KAPAK  118 Pouch Sealer. 18 in. Wide.. $250 AS IS View Details and Photo
KARL SUSS  MA150 6 in. High Performance Cassette to Cassette Mask Aligner. PC control with plasma touch screen operation. Can handle up to 1000W lamps. System is currently configured for 6 in. dia. wafers. Both proximity and contact modes. Throughput of up to 80 wafers per hour. Splitfield microscope optics for fast alignment. Flat finder.. $85,000 View Details and Photo
KARL SUSS  MAGNETIC BASE PROBE Precision probe manipulator.. $750 View Details and Photo
KARL SUSS  MJB3-IR Mask Aligner with Backside and Topside Alignment Capabilities. The scanning backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The alignment microscope uses 5X, 10X and 20X objective lenses for either backside or topside alignment. For topside alignment the eyepieces are 12.5X. The exposure source is a 350W Hg lamp powered by a Suss Model 505 supply. The system incorporates UV-400 optics to transfer the energy to the substrate. The substrate may be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact(high precision “HP”) is available.. $65,000 View Details and Photo
KARL SUSS  PM8 6 in. Manual Analytical Probe System. Manual Submicron Probing System. 6 in. Dia. vacuum chuck with fine-glide movement. Bausch & Lomb microzoom with long working distance objectives. Ergonomic operation. Platen accepts vacuum or magnetic base probe manipulators. Includes probe card holder. . $15,000 View Details and Photo
KARL SUSS  RC-5 Gyrset Spin Coater. Ideal for square, rectangular or irregularly shaped components, coats uniformly without corner effects or discernible edge bead. Handles up to 4 in. dia. wafers.. $9,500 View Details and Photo
KARL SUSS  VACUUM BASE PROBE Precision probe manipulator.. $750 View Details and Photo
KAYENESS  7050 Melt Flow Indexer. Five program memory stores different materials or test conditions. Digital display. Temperature ambient to 300 deg C +/-0.1 deg C. Viscosity: 0.1 poise to 1 Mpoise. Shear Rate: 0.0001 to 10,000/sec. 120V, 60 Hz, 5A.. $2,950 View Details and Photo
KELVINATOR SCIENTIFIC  BT30RSFMS-4 Flammable Materials Storage Cooler. Temp. Range: 3 to 13 deg C. Cubic Ft. Capacity: 27.3. Inside Dimensions: 26 in. L x 26 in. W x 53 in. H. LCD temperature readout. Small dent in door. 115V, 60 Hz.. $950 View Details and Photo
KENSINGTON LABORATORIES  8500 10X6 Stage only, no controller or cables. Stage Movement: 6 in. x 10 in.. $750 View Details and Photo
KENSINGTON LABORATORIES  WFH3B TT/LR/FF Wafer Transfer Robot. Model 4000B motor drive box. No PC or software with system. We can’t test this unit, came off of a working system. 120V, 50/60 Hz.. $2,950 View Details and Photo
KEYTEK  ZAPMASTER ESD Test Station. Does not have computer or software. Selling AS IS with a 30 day right to return. We can’t test this system.. $4,950 View Details and Photo
KIMBALL PHYSICS  EGPS-12A Electron Gun Power Supply. Intended for use in reflection high energy electron diffraction studies. For use with EMG-12 electron gun (not included). All neccessary voltages to drive EMG-12 electron gun. 105/125V, 50/60 Hz.. $3,950 View Details and Photo
KINETIC SYSTEMS  1201-04-11 Large Vibration Isolation Table. Dimensions: 71 in. L x 30 in. W x 29 in. H.. $2,250 View Details and Photo
KINETIC SYSTEMS  2219-02S-11 Tabletop Vibration Isolation Platform. Pneumatic vibration isolation platform with self leveling. Dimensions: 36 in. x 24 in.. $995 View Details and Photo
KINETIC SYSTEMS  390188-01-0711 Table Top Vibration Isolation Platform. Air controlled vibration isolation with self leveling control. Dimensions: 36 in. L x 24 in. W x 3-1/4 in. H.. $995 View Details and Photo
KLA  1007 Automatic Wafer Prober. 100 wafer capacity reduces loading/unloading requirements. The system accepts wafers from 3-6 in. in dia. Probe Tip Polishing: Programmable probe tip polisher uses a fused ceramic disk. Utilities:100/115/200/220/240 VAC, 50/60 Hz., 2.2 KVA XY Table: Standard travel 7.3 x 15.0 in. Speed: 4.9 in./sec. Resolution: .01 mil. Accuracy including alignment: .5 mil. Repeatability: +/-.1 mil. XY index setting:.1 to 9999.9 mils. Vertical Max. travel: 590 mils. Adaptive range: 352-531 mils. Programmable overdrive: 0-8 mils. Rotational: Chuck rotation +/- degrees. Angular resolution: .0005 degrees. 6 in. chuck. Sold As Is.. $2,500 AS IS View Details and Photo
KLA/TENCOR  FLX-2320 500 deg C Thin Film Stress Measurement System. Uses laser scanning technology to provide accurate measurement of thin film stress. Stress can be monitored at temperatures up 500 deg C. Advanced dual wavelength technology allows all types of films, even transparent films to be accommodated. Scan range up to 200 mm. 230V, 1 Ph, 60 Hz, 15A.. $29,500 View Details and Photo
KLA/TENCOR  HRP-220 High Resolution Profiler. Fully automated surface metrology system. Combines the long scan capability, repeatability and ease of use of a stylus profiler with the fine area, high resolution analysis and imaging capabilities of an atomic force microscope. Provides long scans up to 205 mm, plus fine area analysis of submicron features as small as 0.25 microns. Step height repeatability 8 angstrom max. in the +/-3.25 micro-meter range.. $65,000 View Details and Photo
KLA/TENCOR  P-11 Long Scan Surface Profiler. Provides high precision surface topography measurements and analysis. Quickly characterizes step heights, roughness, waviness, process induced stress, radius of curvature and a range of geometrical features. 8 in. max. scan length, scan speed 1 micrometer/s. Microhead SR low force measurement head. 115V, 60 Hz, 4A.. $35,000 View Details and Photo
KLA/TENCOR  P-11 Long Scan Surface Profiler. Provides high precision surface topography measurements and analysis. Quickly characterizes step heights, roughness, waviness, process induced stress, radius of curvature and a range of geometrical features. 8 in. max. scan length. Scan Speed: 1 micro-meter/s. Microhead SR low force measurement head. 115V, 60 Hz, 4A.. $35,000 View Details and Photo
KLA/TENCOR  SURFSCAN 6220 Unpatterned Surface Inspection System. Specifications: Substrate/Sizes: 2 in., 3 in., 82*, 100, 125, 150, 200 mm. Thickness: SEMI standard wafer thickness. Material: Any opaque, polished surface which scatters less than 5 percent of incident light. *Smaller sizes factory-set at time of order. Defect Sensitivity: 0.09 micrometer diameter PSL sphere equivalent with greater than 80 percent capture rate. Haze/Sensitivity: 0.02 ppm minimum. Resolution: 0.002 ppm. Repeatability: Count repeatability error less than 0.5 percent at 1 standard deviation (Mean count greater than 500, 0.364 mm dia. latex spheres). Accuracy: Count Accuracy: Better than 99 percent (verified with VLSI Standards’ Relative Standard). Spatial Resolution: 50 mm spacing, minimum. Dynamic Range: 0.07 micrometer to 9,999 mm in a single measurement. Throughput: 100 wph (200 mm) at 0.12 mm. Contamination: Less than 0.005 particles/cm2 greater than 0.15 mm dia. per single pass. Cassette Handling: Single puck wafer handling from two cassettes (one sender/receiver, one receiver). Illumination Source: 30 mW Argon-Ion laser, 488 nm wavelength Operator Interface: Mouse and/or dedicated user keypad. Physical Characteristics/Height: 168 cm (66 in.). Shipping Weight: 300 kg (670 lbs). Installation Requirements/Vacuum: 508 mm (20 in.) Hg. Electrical: 200-240V, 50/60 Hz. Power Requirement: 2 kVA Ducted Venting: Two 102 mm (4 in.) exhaust hoses. Environment: Class 10 or better.. $75,000 View Details and Photo
KLA/TENCOR  SURFSCAN 6220 Unpatterned Surface Inspection System. Specifications: Substrate/Sizes: 2 in., 3 in., 82*, 100, 125, 150, 200 mm. Thickness: SEMI standard wafer thickness. Material: Any opaque, polished surface which scatters less than 5 percent of incident light. *Smaller sizes factory-set at time of order. Defect Sensitivity: 0.09 micrometer diameter PSL sphere equivalent with greater than 80 percent capture rate. Haze/Sensitivity: 0.02 ppm minimum. Resolution: 0.002 ppm. Repeatability: Count repeatability error less than 0.5 percent at 1 standard deviation (Mean count greater than 500, 0.364 mm dia. latex spheres). Accuracy: Count Accuracy: Better than 99 percent (verified with VLSI Standards’ Relative Standard). Spatial Resolution: 50 mm spacing, minimum. Dynamic Range: 0.07 micrometer to 9,999 mm in a single measurement. Throughput: 100 wph (200 mm) at 0.12 mm. Contamination: Less than 0.005 particles/cm2 greater than 0.15 mm dia. per single pass. Cassette Handling: Single puck wafer handling from two cassettes (one sender/receiver, one receiver). Illumination Source: 30 mW Argon-Ion laser, 488 nm wavelength Operator Interface: Mouse and/or dedicated user keypad. Physical Characteristics/Height: 168 cm (66 in.). Shipping Weight: 300 kg (670 lbs). Installation Requirements/Vacuum: 508 mm (20 in.) Hg. Electrical: 200-240V, 50/60 Hz. Power Requirement: 2 kVA Ducted Venting: Two 102 mm (4 in.) exhaust hoses. Environment: Class 10 or better.. $75,000 View Details and Photo
KLA/TENCOR  SURFSCAN 6220 Unpatterned Surface Inspection System. Specifications: Substrate/Sizes: 2 in., 3 in., 82*, 100, 125, 150, 200 mm. Thickness: SEMI standard wafer thickness. Material: Any opaque, polished surface which scatters less than 5 percent of incident light. *Smaller sizes factory-set at time of order. Defect Sensitivity: 0.09 micrometer diameter PSL sphere equivalent with greater than 80 percent capture rate. Haze/Sensitivity: 0.02 ppm minimum. Resolution: 0.002 ppm. Repeatability: Count repeatability error less than 0.5 percent at 1 standard deviation (Mean count greater than 500, 0.364 mm dia. latex spheres). Accuracy: Count Accuracy: Better than 99 percent (verified with VLSI Standards’ Relative Standard). Spatial Resolution: 50 mm spacing, minimum. Dynamic Range: 0.07 micrometer to 9,999 mm in a single measurement. Throughput: 100 wph (200 mm) at 0.12 mm. Contamination: Less than 0.005 particles/cm2 greater than 0.15 mm dia. per single pass. Cassette Handling: Single puck wafer handling from two cassettes (one sender/receiver, one receiver). Illumination Source: 30 mW Argon-Ion laser, 488 nm wavelength Operator Interface: Mouse and/or dedicated user keypad. Physical Characteristics/Height: 168 cm (66 in.). Shipping Weight: 300 kg (670 lbs). Installation Requirements/Vacuum: 508 mm (20 in.) Hg. Electrical: 200-240V, 50/60 Hz. Power Requirement: 2 kVA Ducted Venting: Two 102 mm (4 in.) exhaust hoses. Environment: Class 10 or better.. $75,000 View Details and Photo
KLA/TENCOR  SURFSCAN 6220 Unpatterned Surface Inspection System. Specifications: Substrate/Sizes: 2 in., 3 in., 82*, 100, 125, 150, 200 mm. Thickness: SEMI standard wafer thickness. Material: Any opaque, polished surface which scatters less than 5 percent of incident light. *Smaller sizes factory-set at time of order. Defect Sensitivity: 0.09 micrometer diameter PSL sphere equivalent with greater than 80 percent capture rate. Haze/Sensitivity: 0.02 ppm minimum. Resolution: 0.002 ppm. Repeatability: Count repeatability error less than 0.5 percent at 1 standard deviation (Mean count greater than 500, 0.364 mm dia. latex spheres). Accuracy: Count Accuracy: Better than 99 percent (verified with VLSI Standards’ Relative Standard). Spatial Resolution: 50 mm spacing, minimum. Dynamic Range: 0.07 micrometer to 9,999 mm in a single measurement. Throughput: 100 wph (200 mm) at 0.12 mm. Contamination: Less than 0.005 particles/cm2 greater than 0.15 mm dia. per single pass. Cassette Handling: Single puck wafer handling from two cassettes (one sender/receiver, one receiver). Illumination Source: 30 mW Argon-Ion laser, 488 nm wavelength Operator Interface: Mouse and/or dedicated user keypad. Physical Characteristics/Height: 168 cm (66 in.). Shipping Weight: 300 kg (670 lbs). Installation Requirements/Vacuum: 508 mm (20 in.) Hg. Electrical: 200-240V, 50/60 Hz. Power Requirement: 2 kVA. Ducted Venting: Two 102 mm (4 in.) exhaust hoses. Environment: Class 10 or better.. $75,000 View Details and Photo
KLA/TENCOR  SURFSCAN 6420 Unpatterned Surface Inspection System. Easily detects sub-micron particles on rough surfaces such as polysilicon and tungsten, yet provides sensitivity better than 0.10 micrometers on polished silicon and epitaxial layers. Particle data is provided in 2 and 3 dimensional displays. Sample sizes from 100 mm to 200 mm. 208V, 1 Ph, 60 Hz, 16A.. $175,000 View Details and Photo
KLINGER  STAGE Vertical Movement Linear Positioning Stage. Motor: UE30.. $350 View Details and Photo
KLINGER  Z STAGE Motorized Z Translation Stage. Vertical movement translation stage. Travel Range: +/-4.5 mm (9 mm). VE-72 stepper motor. Load Capacity: Up to 30 kgf. Stage size excluding motor: 252 x 168. Resolution: 1 micro-meter. Stage only no controller.. $1,250 View Details and Photo
KODAK  4540MX HS Motion Analyzer Ultra High Speed Recording System. Records up to 4,500 full frames per second and up to 40,500 pictures per second for immediate playback. These speeds allow analysis and image storage of extremely rapid events.. $2,950 View Details and Photo
KODAK  M43A Film Processor. $2,950 View Details and Photo
KONTRON  LA248A Logic Analyzer. No probes.. $650 View Details
KRELL TECHNOLOGIES  SpecMaster II High Performance Fiber Optic Connector Polisher.. $1,950 View Details and Photo
K-SINE  K-1400-DEL Ultrasonic Power Source for Wire Bonders. $650 View Details and Photo
KTC  BT 30 Bond/Shear Tester. Microprocessor controlled combination die and ball bond shear tester. The Bondtest 30 performs destruct and non-destruct testing. Test results are displayed on a peak hold digital read-out meter. Plug-in force transducers may be simply interchanged to accommodate differing force requirements.. $4,250 View Details and Photo
KTC  BT-30 Bond/Shear Tester. Microprocessor controlled combination die and ball bond shear tester. The Bondtest 30 performs destruct and non-destruct testing. Test results are displayed on a peak hold digital read-out meter. Plug-in force transducers may be simply interchanged to accommodate differing force requirements.. $4,250 View Details and Photo

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Note: All manufacturers names and models are used for illustrative purposes only. Any trademarks, tradenames or copyrights remain solely the property of the manufacturer. Unless otherwise stated, all items are used, and Bid-Service is not a manufacturer authorized representative. All images are copyright 2001, 2002, 2003, 2004, 2005, 2006, 2007 Bid-Service LLC/Sci-Quip and may not be used for any purpose without prior written permission

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