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MRC  603-II Side Sputtering System w/Etch Capabilities. Currently configured with 3 D.C. Magnetron Cathodes (inset cathodes). Alcatel 2033 Roughing Pump. CTI-8 Cryopump. 1500W RF Generator. Automatic or manual controls for vacuum system and sputtering process. 4 process gas capability. Average cycle time: 13.0 minutes. Typical target utilization: Ti-W Inset 35 percent, Al Inset 50 percent. Cathode size: 4-3/4 in. x 14-7/8 in. Sputter etch: 1.5 kW RF. CRT screen monitoring, keyboard parameter control, full automation. With manuals. 208V, 60 Hz, 3 Ph, 110A.. $69,000 View Details and Photo

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