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Phone: 732-863-9500
FAX: 732-863-1255
Email:
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Tegal Inventory in Stock:
| Manufacturer/Model |
Description |
Info
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TEGAL
6000 |
3 Chamber Magnetically Enhanced Reactive Ion Etching System (MERIE).
Designed to etch metals, dielectrics and III-V compounds.
Tool configured to handle 150 mm wafers.
Additional photos available..
$125,000 |
View Details and Photo
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TEGAL
801 |
Inline Plasma Etcher.
Fully automatic, microprocessor-based, plasma chemistry etcher designed especially for the etching of thin films deposited on semiconductor wafers. All gas flow rates controlled by mass flow controllers..
$19,500 |
View Details and Photo
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TEGAL
803 |
Inline Automatic Plasma Etcher.
The Plasma Inline 803 is a fully automatic, microprocessor-based plasma chemistry etcher designed especially for the etching of silicon dioxide (Si02) thin film deposited on single crystal or polysilicon semiconductor wafers. It provides up to four process gases, two process channels and a clean channel..
$19,500 |
View Details and Photo
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TEGAL
900E |
Cassette to Cassette Single Wafer Photoresist Stripper.
Low particulate spatula handling system.
System configured for 4 in. wafers.
CRT with process graphics.
ENI 13.56 MHz RF Generator.
With roughing pump.
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$29,000 |
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TEGAL
900E |
Cassette to Cassette Photoresist Strip/Backside Etching.
Spatula wafer transport from cassette to cassette.
Users are guided through programming and
operation by menu-driven software and soft-keys
via a built in display and an external terminal.
System is currently configured for 4 in. wafers..
$29,000 |
View Details and Photo
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TEGAL
901E |
Cassette to Cassette Polysilicon/Silicon Nitride Plasma Etcher.
Currently configured for 3 in. wafers.
13.56 MHz RF Generator.
Easy to use menu driven control.
Input gases controlled by MFC, up to 4 MFC with system.
Non-friction spatula wafer transport.
System comes with oxygen service pump..
$29,000 |
View Details and Photo
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TEGAL
903E |
Cassette To Cassette In-line Single Wafer Plasma Etcher.
Capability to etch vias and contacts with anisotropic or sloped profiles.
For etching silicon dioxide, silicon nitrides, and polyimides.
Can handle wafers from 3 in. to 6 in. but currently configured for 5 in. wafers.
Microprocessor control.
208 V, 50/60 Hz..
$29,000 |
View Details and Photo
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