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Tencor Inventory in Stock:

Manufacturer/Model Description

Info
TENCOR  Auto RS55/TC Four Point Probe Resistivity Mapping System with Temperature Compensation and Wafer Handler. Stainless steel clean room version. Cassette to cassette measurement. Display modes include contour maps, 3-D plots and diameter scans. Can compensate sheet resistance measurements against ambient temperature and materials TCR. Accommodates wafers up to 200 mm. 115V, 50/60 Hz.. $39,500 View Details and Photo
TENCOR  FLX-2908 900 deg C Thin Film Stress Measurement System. Provides accurate analysis of thin film stress with very low measurement noise. Allows observation and quantitative evaluation of stress relaxation, oxide densification, thin film phase transformations and annealing. Scan range user programmable up to 200 mm. Wafer Sizes: 125, 150, 200 mm. 230V, 1 Ph, 60 Hz, 30A.. $39,500 View Details and Photo
TENCOR  P20H Long Scan Profiler. Measurement of vertical features ranging from under 100 angstrom to approximately 0.3 mm, with a vertical resolution of 1 or 25 angstrom. Ability to fit and level data, allowing accurate measurements on curved surfaces. Handles wafers from 3 to 8 in. Full 8 in. scanning. Can scan up to 25 wafers without operator intervention.. $39,000 View Details and Photo
TENCOR  P-30 SMIF Interface Surface Profiler. Provides comprehensive analysis of surface topography. Profiling Performance: Scan Length: 210 mm. Stylus Force: 0.05 to 50 mg. Vertical Range/Resolution: +/- 3.2 micrometers/0.05 angstroms. +/- 13 micrometers/2 angstroms. +/- 130 micrometers/10 angstrom. Pattern recognition.. $32,500 View Details and Photo
TENCOR  RS35C Resistivity Mapping System Four Point Probe. The OmniMap collects and analyzes sheet resistance data on various conductive layers such as implants, diffusions, epi, CVD, metals and bulk substrates. Provides accurate and repeatable sheet resistance measurements from 5m ohms/sq to 5M ohms/sq on 2 in. (50mm) to 8 in. (200mm) wafers by uniting sophisticated modeling algorithms, advanced analysis techniques and precision electronics. Measures up to 1264 sites per wafer using standard or user-defined patterns, and displays test results in the form of contourmaps, 3-D maps, diameter scans and die maps.. $25,000 View Details and Photo
TENCOR  SURFSCAN 6100 Unpatterned Wafer Surface Contamination Analyzer. Submicron sensitivity, detects 0.16 micron particles. Instantaneous magnified 3-D views of individual defects. Color coded defect maps, histograms and other graphics. Surface haze detection. Capable of handling 4 in., 5 in. and 6 in. wafers.. $39,000 View Details and Photo
TENCOR  SURFSCAN 6100 Unpatterned Wafer Surface Contamination Analyzer. Submicron sensitivity, detects 0.16 micron particles. Instantaneous magnified 3-D views of individual defects. Color coded defect maps, histograms and other graphics. Surface haze detection. Capable of handling 4, 5 and 6 in. wafers.. $39,000 View Details and Photo
TENCOR  SURFSCAN 6200 Wafer Surface Analysis System For Non-Patterned Wafers. Can accommodate wafers from 2 to 8 in. dia. Sensitivity - Particle: .117 micro-meter dia. latex spheres with >90 percent capture rate. Haze: .1 ppm minimum. Cassette to cassette handling. Supplies enlarged 3D images, scan prints for quick analysis.. $79,000 View Details and Photo
TENCOR  SURFSCAN 7000 Patterned Wafer Contamination Analyzer can detect surface defects as small as 0.5 micro-meters. Unique optics and software distinguish particles from circuit patterns for maximum sensitivity on all process levels. Fully automatic. Color particle maps and data summaries are clearly displayed. Sensitivity: 0.8 micro-meters (latex spheres on bare silicon) Substrate size: 100 to 200mm wafers. Throughput: 100 to 150mm - 20 wafers/hr. 200mm wafers - 12 wafers/hr. Scan modes: Pattern viewing, Microscan. $35,000 View Details and Photo
TENCOR  SURFSCAN AIT Model 8010 Advanced In-Line Defect Inspection System. Automated full wafer inspection system for detecting particles as small as 0.10 micro-meters on bare silicon and patterned process wafers. High detection sensitivity even for difficult after-etch, develop, and chemical mechanical polishing. High throughput of up to 30 full wafer scans per hour on 200 mm wafers.. $49,000 View Details and Photo
TENCOR  UV-1250SE Combination UV Spectroscopic Ellipsometry and Broadband UV Spectrophotometry Thin Film Measurement System. Combines spectroscopic ellipsometry technology with broadband ultraviolet (UV) spectrophotometry. Allows the user to obtain unique simultaneous multi-layer/simultaneous multi-variable measurements, which include thickness, refractive index, and extinction coefficients, with excellent accurracy. CALL FOR PRICE. $- View Details and Photo

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