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YIELD ENGINEERING
YES-310 |
Dual Function Vapor Prime and Image Reversal Vacuum Oven.
Capacity for HMDS prime or image reversal: 8 cassettes of 4 in. wafers or 1 cassette of 5 to 8 in. wafers.
Throughput for HMDS prime: 2 full loads per hour.
Throughput for image reversal: 2-1/2 loads per hour.
Max. Temp.: 250 deg C.
Inside Dimensions: 12 in. L x 13 in. W x 12 in. H.
Includes vacuum pump..
$22,500 |
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YIELD ENGINEERING
YES-5 |
HMDS Vapor Prime Oven.
Vapor prime oven with a max. bake temperature of 275 deg C.
Inside Dimensions: 16 in. L x 16 in. W x 16 in. H.
Capacity: 8 cassettes of 6 in. wafers.
Includes vacuum pump..
$15,000 |
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YIELD ENGINEERING
YES-58 |
Vapor Prime Oven.
For total dehydration and HMDS prime deposition.
Max. Temp.: 275 deg C.
Inside Dimensions: 16 in. L x 16 in. W x 16 in. H.
Includes vacuum pump..
$9,500 |
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YIELD ENGINEERING
YES-FPO |
Large Vacuum Bake/Vapor Prime Oven.
Vapor prime oven can hold up to 2 cassettes of 300 mm wafers or 16 cassettes
of 150 mm wafers.
Inside Dimensions: 25 in. L x 20 in. W x 25 in. H.
Max. Temp.: 160 deg C.
Up to 8 process recipes. Includes vacuum pump.
208V, 3 Ph, 60 Hz..
$19,000 |
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YIELD ENGINEERING
YES-R1 |
Plasma Cleaning System.
Total plasma uniformity across 12.75 in. x 12.75 in. planar sample shelves, 5 shelves total.
1000W RF Generator.
Capacitive, parallel plate, downstream, charge-free plasma.
3 gas inputs. Includes vacuum pump..
$25,000 |
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YIELD ENGINEERING
YES-R3 |
Plasma Cleaning System.
Capacitive down stream plasma.
Total plasma uniformity across planar 12 in. x 12 in. sample shelves.
Includes vacuum pump..
$19,500 |
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YIELDUP
OMEGA 6200 |
Megasonic Wafer Cleaning System.
Robot assist between 2 tanks.
Set up for 2 - 200 mm cassettes.
Tank 1: 11 in. L x 20 in. W x 15 in. H is a quartz megasonic tank with 3 - 600W KAJO
megasonic generators.
Tank 2: 12 in. L x 20 in. W x 14 in. H is a YieldUp dryer tank with N2 purge and gas injection capability.
Mfg. Date: 12/97.
Overall Dimensions: 60 in. L x 60 in. W x 88 in. H..
$49,500 |
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