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YIELD ENGINEERING
CV100P |
Downstream Plasma Stripper. Auto load and unload from cassette. Single wafer processing.
Strip rate dependant upon wafer temp. up to 15,000 angstrom per minute strip rate. Rapid temp. ramp with real-time temp. readout.
Touch screen programming. Includes corrosive series vacuum pump.
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$19,000 |
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YIELD ENGINEERING
YES-310 |
Dual Function Vapor Prime and Image Reversal Vacuum Oven.
Capacity for HMDS prime or image reversal: 8 cassettes of 4 in. wafers or 1 cassette of 5 to 8 in. wafers.
Throughput for HMDS prime: 2 full loads per hour.
Throughput for image reversal: 2-1/2 loads per hour.
Max. Temp.: 250 deg C.
Inside Dimensions: 12 in. L x 13 in. W x 12 in. H.
Includes vacuum pump..
$22,500 |
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YIELD ENGINEERING
YES-450 PB |
High Temperature Vacuum Polyimide Bake Oven.
During operation, nitrogen, which is preheated to the selected operating temperature, passes in laminar flow from the roof of each individual chamber down over the cassettes of wafers and out each chamber base.
Designed to operate at temperatures up to 450 deg C with set, ramp and hold control.
4 Chambers: 8 in. L x 16 in. W x 7-1/2 in. H bake up to 8 cassettes of 6 in. wafers.
208V, 3 Ph, 60 H. Includes vacuum pump..
$32,000 |
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YIELD ENGINEERING
YES-58 |
Vapor Prime Oven.
For total dehydration and HMDS prime deposition.
Max. Temp.: 275 deg C.
Inside Dimensions: 16 in. L x 16 in. W x 16 in. H.
Includes vacuum pump..
$9,500 |
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YIELD ENGINEERING
YES-FPO |
Large Vacuum Bake/Vapor Prime Oven.
Vapor prime oven can hold up to 2 cassettes of 300 mm wafers or 16 cassettes
of 150 mm wafers.
Inside Dimensions: 25 in. L x 20 in. W x 25 in. H.
Max. Temp.: 160 deg C.
Up to 8 process recipes. Includes vacuum pump.
208V, 3 Ph, 60 Hz..
$19,000 |
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YIELD ENGINEERING
YES-R1 |
Plasma Cleaning System.
Total plasma uniformity across 12.75 in. x 12.75 in. planar sample shelves, 5 shelves total.
1000W RF Generator.
Capacitive, parallel plate, downstream, charge-free plasma.
3 gas inputs. Includes vacuum pump..
$25,000 |
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YIELD ENGINEERING
YES-R3 |
Plasma Cleaning System.
Digital programmable process control.
Total plasma uniformity
across planar 12 in. x 12 in. sample shelves.
Capacitive, parallel plate, downstream, charge-free plasma.
Includes vacuum pump..
$19,500 |
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YIELD ENGINEERING
YES-R3 |
Plasma Cleaning System.
Capacitive down stream plasma.
Total plasma uniformity across planar 12 in. x 12 in. sample shelves.
Includes vacuum pump..
$19,500 |
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YIELDUP
OMEGA 6200 |
Megasonic Wafer Cleaning System.
Robot assist between 2 tanks.
Set up for 2 - 200 mm cassettes.
Tank 1: 11 in. L x 20 in. W x 15 in. H is a quartz megasonic tank with 3 - 600W KAJO
megasonic generators.
Tank 2: 12 in. L x 20 in. W x 14 in. H is a YieldUp dryer tank with N2 purge and gas injection capability.
Mfg. Date: 12/97.
Overall Dimensions: 60 in. L x 60 in. W x 88 in. H..
$49,500 |
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